Song Ci, Shi Feng, Zhang Wanli, Lin Zhifan, Lin Yuxuan
Laboratory of Science and Technology on Integrated Logistics Support, College of Intelligence Science and Technology, National University of Defense Technology, Changsha 410073, China.
Materials (Basel). 2020 Jan 24;13(3):569. doi: 10.3390/ma13030569.
The silica opticsare widely applied in the modern laser system, and its fabrication is always the research focus. In the manufacturing process, the lapping process occurs between grinding and final polishing. However, lapping processes optimizations focus on decreasing the depth of sub-surface damage (SSD) or improving lapping efficiency individually. So, the optimum balance point between efficiency and damageshould be studied further. This manuscript establishes the effective removal rate of damage (ERRD)model, and the relationship between the ERRD and processing parameters is simulated. Then, high-efficiency, low-damage lapping processing routine is established based on the simulation. The correctness and feasibility are validated. In this work, the optimized method is confirmed that it can improve efficiency and decrease damage layer depth in the lapping process which promotes the development of optics in low-damage fabrication.
二氧化硅光学元件在现代激光系统中广泛应用，其制造一直是研究重点。在制造过程中，研磨过程介于磨削和最终抛光之间。然而，研磨工艺优化分别侧重于降低亚表面损伤（SSD）深度或提高研磨效率。因此，效率与损伤之间的最佳平衡点有待进一步研究。本文建立了损伤有效去除率（ERRD）模型，并模拟了ERRD与加工参数之间的关系。然后，基于模拟建立了高效、低损伤的研磨加工工艺。验证了其正确性和可行性。在这项工作中，证实了优化方法能够在研磨过程中提高效率并减小损伤层深度，这推动了光学元件低损伤制造的发展。
