Harnois Maxime, Himdi Mohamed, Yong Wai Yan, Rahim Sharul Kamal Abdul, Tekkouk Karim, Cheval Nicolas
Institut d'électronique et des Télécommunication de Rennes, UMR CNRS 6164, Université de Rennes 1, Campus de Beaulieu, 35042, Rennes Cedex, France.
Department of Electrical Engineering, University of Twente, 7500AE, Enschede, Netherlands.
Sci Rep. 2020 Feb 3;10(1):1714. doi: 10.1038/s41598-020-58657-5.
Manufacturing an array of high-quality metallic pattern layers on a dielectric substrate remains a major challenge in the development of flexible and 3-D frequency selective surfaces (FSS). This paper proposes an improved fabrication solution for the 3-D FSS based on water transfer printing (WTP) technology. The main advantages of the proposed solution are its ability to transform complicated 2-D planar FSS patterns into 3-D structures while improving both manufacturing quality and production costs. WTP technology makes use of water surface tension to keep the thin metallic patterns of the proposed FSS floating flat with the absence of a solid planar substrate. This feature enables these metallic FSS patterns to be transferred onto 3-D structures through a dipping process. To test the effectiveness of the proposed technique, the FSS was designed using computer simulation software Microwave Studio to obtain the numerical performance of the FSS structure. The WTP technology was then used to fabricate the proposed FSS prototype before its performance was tested experimentally. The measurement results agreed well with the numerical results, indicating the proposed manufacturing solution would support the development of complicated 3-D electronics devices, such as conformal antenna arrays and metamaterials.
在介电基片上制造一系列高质量的金属图案层仍然是柔性和三维频率选择表面(FSS)发展中的一项重大挑战。本文提出了一种基于水转印(WTP)技术的改进型三维FSS制造解决方案。该解决方案的主要优点在于能够将复杂的二维平面FSS图案转换为三维结构,同时提高制造质量并降低生产成本。WTP技术利用水的表面张力,使所提出的FSS的薄金属图案在没有固体平面基片的情况下保持平整漂浮。这一特性使得这些金属FSS图案能够通过浸渍工艺转移到三维结构上。为了测试所提出技术的有效性,使用计算机模拟软件Microwave Studio设计FSS,以获得FSS结构的数值性能。然后使用WTP技术制造所提出的FSS原型,之后对其性能进行实验测试。测量结果与数值结果吻合良好,表明所提出的制造解决方案将有助于复杂三维电子设备的发展,如共形天线阵列和超材料。