Liu Qiman, Zhang Chengyu, Xu Chang, Hu Shuanglin, Cheng Longjiu
Department of Chemistry, Anhui University, Hefei, Anhui 230601, P. R. China.
Phys Chem Chem Phys. 2020 Feb 21;22(7):3921-3926. doi: 10.1039/c9cp06180k. Epub 2020 Feb 4.
Owing to their unique properties, thiolate-protected gold clusters (denoted as Au(SR)) have attracted intense research interest both experimentally and theoretically. The superatom complex (SAC) and superatom network (SAN) models are significantly well-known concepts to explain the electronic stability of Au(SR). Based on the structural characters of Au(SR), the tetrahedral Au unit was found to be an elementary building block and used to design a series of tetrahedron-network clusters. In this work, we first build a Au(μ-S)(SH) cluster consisting of a network of four non-conjugated tetrahedral Au units and confirm that it is a local minimum on the potential energy surface by density functional theory calculations. Chemical bonding analysis by the AdNDP method reveals that the electronic structure of Au(μ-S)(SH) follows the SAN (4 × 2e) model. Based on the structural character of the Au(μ-S)(SH) cluster, we utilize the diamond lattice as a template to construct a stable AuS crystal in which each S atom binds to four Au superatoms. The computational results demonstrate that the structure has rather good dynamic and thermal stabilities, and it is an indirect semiconductor with a band gap of 2.68 eV at the HSE06 level. Chemical bonding analysis performed by the SSAdNDP method reveals that the AuS can be seen as a SAN crystal. These bonding patterns and properties of the solid provide references for further investigation of cluster-assembled materials.
由于其独特的性质,硫醇盐保护的金簇(表示为Au(SR))在实验和理论上都引起了广泛的研究兴趣。超原子复合物(SAC)和超原子网络(SAN)模型是解释Au(SR)电子稳定性的显著知名概念。基于Au(SR)的结构特征,发现四面体金单元是一个基本构建块,并用于设计一系列四面体网络簇。在这项工作中,我们首先构建了一个由四个非共轭四面体金单元网络组成的Au(μ-S)(SH)簇,并通过密度泛函理论计算证实它是势能面上的一个局部最小值。通过AdNDP方法进行的化学键分析表明,Au(μ-S)(SH)的电子结构遵循SAN (4 × 2e)模型。基于Au(μ-S)(SH)簇的结构特征,我们以金刚石晶格为模板构建了一种稳定的AuS晶体,其中每个S原子与四个金超原子结合。计算结果表明,该结构具有相当好的动力学和热稳定性,并且在HSE06水平下是一种带隙为2.68 eV的间接半导体。通过SSAdNDP方法进行的化学键分析表明,AuS可以被视为一种SAN晶体。固体的这些键合模式和性质为进一步研究团簇组装材料提供了参考。