Skwarek Agata, Illés Balázs, Hurtony Tamás, Bušek David, Dušek Karel
Łukasiewicz Research Network-Institute of Electron Technology, Kraków Division, 30701 Krakow, Poland.
Department of Electrotechnology, Czech Technical University in Prague, 16627 Prague, Czech Republic.
Materials (Basel). 2020 Feb 21;13(4):968. doi: 10.3390/ma13040968.
The effect of recrystallization of 99.3Sn-0.7Cu wt. % solder alloy on the allotropic transition of β to α-Sn (so-called tin pest phenomenon) was investigated. Bulk samples were prepared, and an InSb inoculator was mechanically applied to their surfaces to enhance the transition. Half of the samples were used as the reference material and the other half were annealed at 180 °C for 72 h, which caused the recrystallization of the alloy. The samples were stored at -10 and -20 °C. The β-Sn to α-Sn transition was monitored using electrical resistance measurements. The expansion and separation of the tin grains during the β-Sn to α-Sn transition process were studied using scanning electron microscopy. The recrystallization of the alloy suppressed the tin pest phenomenon considerably since it decreased the number of defects in the crystal structure where heterogeneous nucleation of β-Sn to α-Sn transition could occur. In the case of InSb inoculation, the spreading of the transition towards the bulk was as fast as the spreading parallel to the surface of the sample.
研究了99.3Sn-0.7Cu重量百分比焊料合金的再结晶对β相向α-Sn同素异形转变（即所谓的锡疫现象）的影响。制备了块状样品，并在其表面机械施加InSb孕育剂以促进转变。一半样品用作参考材料，另一半在180°C下退火72小时，这导致合金发生再结晶。将样品储存在-10°C和-20°C下。使用电阻测量监测β-Sn向α-Sn的转变。使用扫描电子显微镜研究了β-Sn向α-Sn转变过程中锡晶粒的膨胀和分离。合金的再结晶显著抑制了锡疫现象，因为它减少了晶体结构中可能发生β-Sn向α-Sn转变非均匀形核的缺陷数量。在InSb孕育的情况下，向块状体内的转变扩展速度与平行于样品表面的扩展速度一样快。
