通过等通道转角挤压-反向挤压（ECAP-Bc）和时效热处理制备高强度高导电性铜铬硅合金

Fabricate of High-Strength and High-Conductivity Cu-Cr-Si Alloys through ECAP-Bc and Aging Heat Treatment.

作者信息

Guo Tingbiao, Wang Junjie, Wu Yibo, Tai Xiaoyang, Jia Zhi, Ding Yutian

机构信息

State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou 730050, Gansu, China.

School of Materials Science and Engineering, Lanzhou University of Technology, Lanzhou 730050, Gansu, China.

出版信息

Materials (Basel). 2020 Apr 1;13(7):1603. doi: 10.3390/ma13071603.

DOI:10.3390/ma13071603

PMID:32244629

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7178309/

Abstract

The effect of equal channel angular pressing (ECAP) through the route Bc and aging treatment on the grain structure and properties of the Cu-1Cr-0.2Si alloy was investigated. Microstructure was detected by scanning electron microscopy (SEM), x-ray diffraction (XRD), and electron backscatter diffraction (EBSD) and the mechanical properties and electrical conductivity were tested. Results shown that after ECAP, accompanying the grains refined to nano-and submicron-structure, the Cr particles were gradually spread along the grain boundaries (GBs), aging treatment promoted Cr particles dispersed in the matrix. ECAP greatly increased the ultimate tensile strength (UTS) while having a small effect on the conductivity, and aging treatment increased electrical conductivity. The stable {111}<110> texture after ECAP and the lower dislocation density after aging treatment maybe the main reasons for the high conductivity of the material.

摘要

研究了通过Bc路径进行等通道转角挤压（ECAP）和时效处理对Cu-1Cr-0.2Si合金晶粒结构和性能的影响。通过扫描电子显微镜（SEM）、X射线衍射（XRD）和电子背散射衍射（EBSD）检测微观结构，并测试力学性能和电导率。结果表明，ECAP后，随着晶粒细化至纳米和亚微米结构，Cr颗粒逐渐沿晶界（GBs）扩散，时效处理促进了Cr颗粒在基体中的分散。ECAP大大提高了极限抗拉强度（UTS），而对电导率影响较小，时效处理提高了电导率。ECAP后稳定的{111}<110>织构和时效处理后较低的位错密度可能是材料高电导率的主要原因。