College of Chemistry and Chemical Engineering, Hunan University, Changsha, 410082, China.
Department of Materials and Chemical Engineering, Hunan Institute of Technology, Hengyang, 421008, China.
Ecotoxicol Environ Saf. 2020 Jul 1;197:110629. doi: 10.1016/j.ecoenv.2020.110629. Epub 2020 Apr 20.
A new Electrocoagulation (EC) technique, sinusoidal AC coagulation (SACC), is creatively put forward for Cu removal in the wastewater from the printed circuit board (PCB) production in this paper. The removal efficiency of Cu from PCB wastewater and energy consumption are compared by SACC and conventional direct current coagulation (DCC). The optimal process parameters were established through analysis of response surface methodology (RSM). The coagulations containing Cu was characterized by SEM, EDS, TEM，BET, XRD and FTIR. The nano-ferrum collosol, mainly composed of goethite (α-FeOOH) and magnetite (γ-FeO), absorbs the Cu and coagulates to remove Cu. The results show that the removal rates of Cu by SACC and DCC are 99.86％ and 98.21％, respectively, and the energy consumption is 2.76 × 10 kWh⋅m for SACC and 4.42 × 10 kWh⋅m for DCC under the optimal process conditions of c (Cu) = 41.99 mg⋅dm, pH = 7.14, j = 0.293 A⋅m, t = 16.7 min. The pilot tests indicate that the SACC technique is feasible in industrial application. Cu removal were completed through electrodeposition of Cu on iron electrode, the deposition of Cu(OH) and the adsorption of Cu by ferrum collosol. The adsorption follows the pseudo-second order kinetics model well. The maximum saturated adsorption capacity (q) of Cu on ferrum collosol produced by SACC is larger than that by DCC. The adsorption of Cu on the ferrum collosol prepared by SACC and DCC are in accordance with Langmuir's adsorption isotherms. The novel SACC technique is a promising technique for the highly-efficient treatment of Cu from PCB wastewater.
本文创新性地提出了一种新的电化学凝固（EC）技术——正弦交流凝固（SACC），用于去除印刷电路板（PCB）生产废水中的铜。通过 SACC 和传统直流凝固（DCC）比较了从 PCB 废水中去除铜的效率和能耗。通过响应面法（RSM）分析确定了最佳工艺参数。采用 SEM、EDS、TEM、BET、XRD 和 FTIR 对含铜的凝固物进行了表征。纳米铁胶体主要由针铁矿（α-FeOOH）和磁铁矿（γ-FeO）组成，吸附铜并凝固去除铜。结果表明，在最佳工艺条件下（c（Cu）=41.99 mg⋅dm、pH=7.14、j=0.293 A⋅m、t=16.7 min），SACC 和 DCC 对铜的去除率分别为 99.86％和 98.21％，能耗分别为 2.76×10kWh⋅m和 4.42×10kWh⋅m。中试试验表明，SACC 技术在工业应用中是可行的。铜的去除是通过铁电极上铜的电沉积、Cu(OH)的沉积和铁胶体的吸附来完成的。吸附过程符合准二级动力学模型。SACC 制备的铁胶体对 Cu 的最大饱和吸附容量（q）大于 DCC 制备的铁胶体。SACC 和 DCC 制备的铁胶体对 Cu 的吸附符合 Langmuir 吸附等温线。新型 SACC 技术是一种高效处理 PCB 废水的有前途的技术。
