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薄膜粘合剂对含形状记忆合金嵌件的碳纤维复合材料中I型层间断裂韧性的影响

The Effect of Thin Film Adhesives on Mode I Interlaminar Fracture Toughness in Carbon Fiber Composites with Shape Memory Alloy Inserts.

作者信息

Quade Derek J, Jana Sadhan C, Morscher Gregory N, Kanaan Manigandan

机构信息

The University of Akron.

NASA Glenn Research Center.

出版信息

Eng Fract Mech. 2019 Feb 1;206:131-146. doi: 10.1016/j.engfracmech.2018.11.040. Epub 2018 Nov 22.

DOI:10.1016/j.engfracmech.2018.11.040

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7473398/

Abstract

Shape Memory Alloy (SMA) was placed within Polymer Matrix Composite (PMC) panels alongside film adhesives to examine bonding. Double cantilever beam (DCB) testing was performed using ASTM D5528. C-scanning was performed before testing, modal acoustic emissions (MAE) were monitored during testing, and microscopy performed post-test. Data was analyzed using modified beam theory (MBT), compliance calibration (CC) and modified compliance calibration (MCC) methods. Fracture toughness for control specimens was higher than previously reported due to fiber-bridging. Specimens with SMAs and adhesives stabilized crack propagation. Results revealed SMA-bridging; a phenomenon mimicking fiber-bridging which increased the load and fracture toughness of SMA specimens.

摘要

形状记忆合金（SMA）与薄膜粘合剂一起放置在聚合物基复合材料（PMC）面板内，以检查粘结情况。使用ASTM D5528进行双悬臂梁（DCB）测试。在测试前进行C扫描，在测试过程中监测模态声发射（MAE），并在测试后进行显微镜检查。使用修正梁理论（MBT）、柔度校准（CC）和修正柔度校准（MCC）方法对数据进行分析。由于纤维桥接，对照试样的断裂韧性高于先前报道的值。含有形状记忆合金和粘合剂的试样使裂纹扩展得到稳定。结果显示出形状记忆合金桥接现象；这是一种类似于纤维桥接的现象，增加了形状记忆合金试样的载荷和断裂韧性。