Tatu Serioja Ovidiu, Moldovan Emilia
Institut National de la Recherche Scientifique, Centre Energie-Matériaux et Télécommunications, INRS-EMT, Montreal, QC H5A 1K6, Canada.
Sensors (Basel). 2020 Sep 24;20(19):5477. doi: 10.3390/s20195477.
Recent advances in millimeter wave technologies, both in component and system design, in line with important size and cost reductions, have opened up new applications in ultra-high-speed wireless communications, radar and imaging sensors. The paper presents the evolution of millimeter wave circuit and modules fabrication and characterization technologies in the past decades. Novel planar low-cost fabrication technologies have been successfully developed in this period. In combination with the standard rectangular wave-guide technology, these offer great opportunities for prototyping and testing of future millimeter wave transceivers or front-ends, which integrate antenna arrays, down-converters, modulators, amplifiers, etc., in a compact fixture. The paper uses, as a suggestive example, the evolution of the multi-port interferometric front-ends implementation from millimeter wave bulky components and systems to miniaturized and high-efficient ones. Circuit and system designs are carefully done to avoid (as much as possible) complicated calibration methods or difficult post-processing of baseband data. This requires an increased effort in design and fabrication, but it allows miniaturization, low-power consumption, while keeping very good overall performances. Useful and straightforward laboratory characterization techniques of circuits and systems are described in detail.
毫米波技术在组件和系统设计方面的最新进展,伴随着尺寸和成本的显著降低,为超高速无线通信、雷达和成像传感器带来了新的应用。本文介绍了毫米波电路及模块制造与表征技术在过去几十年中的发展历程。在此期间,成功开发出了新型平面低成本制造技术。这些技术与标准矩形波导技术相结合,为未来毫米波收发器或前端的原型制作和测试提供了绝佳机会,这些收发器或前端可在紧凑的装置中集成天线阵列、下变频器、调制器、放大器等。本文以多端口干涉式前端的实现过程为例,展示了其从毫米波大型组件和系统到小型化、高效组件和系统的演变。电路和系统设计经过精心考量,尽可能避免复杂的校准方法或基带数据的困难后处理。这需要在设计和制造上付出更多努力,但能实现小型化、低功耗,同时保持非常良好的整体性能。文中详细描述了实用且直接的电路和系统实验室表征技术。