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用于位移调整的刚性压电换能器晶片自动分选系统

Automatic Sorting System for Rigid Piezoelectric Transducer Wafers Used in Displacement Adjustment.

作者信息

Ren Tongqun, Li Xin, Wang Xiaodong, Xu Zheng, Liu Yugang, Yang Jin, Guo Jiang

机构信息

Key Laboratory for Precision & Non-traditional Machining of the Ministry of Education, Dalian University of Technology, Dalian 116024, China.

Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian 116024, China.

出版信息

Micromachines (Basel). 2020 Sep 30;11(10):915. doi: 10.3390/mi11100915.

Abstract

Piezoelectric transducer wafers are usually used in pairs to adjust the resonant cavity length of the ring laser gyro. In practice, the paired wafers are required to have similar piezoelectric charge coefficient d. To handle the pairing operation in-batch, an automatic sorting system was developed on the basis of deformation measurement, which adopted a frame of a Cartesian-coordinate robot. The wafers were self-aligned in the vertical direction, and a vacuum holder was used to pick up, transfer, and then place them on thee testing desk one by one. The excitation voltage was loaded on the wafer by a specifically designed electrode, and the resulting micro deformation was measured by dual opposite inductive micrometers using the relative measurement principle. This particular electrode has the function of attitude self-adjustment and vacuum adsorption, which is conducive to loading the voltage reliably and protecting the wafer from undesired damage. Finally, the wafers were transported to different stock bins based on the measuring results. This system is suited to handle a mass of wafers by continuous processing on site for its high reliability and measurement consistency. The measurement accuracy, validated by laser interferometry, was better than 0.5 μm and the repeatability was superior to 0.1 μm.

摘要

压电换能器晶片通常成对使用,以调节环形激光陀螺的谐振腔长度。在实际应用中,要求成对的晶片具有相似的压电电荷系数d。为了批量处理配对操作,基于变形测量开发了一种自动分选系统,该系统采用了笛卡尔坐标机器人的框架。晶片在垂直方向上自动对齐,使用真空夹具逐个拾取、转移,然后放置在测试台上。通过专门设计的电极向晶片施加激励电压,并使用相对测量原理通过双对面感应式测微计测量产生的微变形。这种特殊的电极具有姿态自调整和真空吸附功能,有利于可靠地加载电压并保护晶片免受不必要的损坏。最后,根据测量结果将晶片输送到不同的料箱中。该系统具有高可靠性和测量一致性,适合通过现场连续处理来处理大量晶片。经激光干涉测量验证,测量精度优于0.5μm,重复性优于0.1μm。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/ec2c/7601652/f9fce1775b4d/micromachines-11-00915-g001.jpg

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