Kyaw Thiha Tin, Hanawa Takao, Kasugai Shohei
Department of Oral Implantology and Regenerative Dental Medicine, Division of Oral Health Sciences, Graduate School of Medical and Dental Sciences, Tokyo Medical and Dental University, 1-5-45 Yushima, Bunkyo-ku, Tokyo, 113-8510, Japan.
Department of Metallic Biomaterials, Institute of Biomaterials and Bioengineering, Tokyo Medical and Dental University, Tokyo, Japan.
Int J Implant Dent. 2020 Nov 8;6(1):64. doi: 10.1186/s40729-020-00265-z.
To evaluate the effects of electrolysis on cleaning the contaminated healing abutment surface and to detect the optimal condition for cleaning the contaminated healing abutment.
Ninety healing abutments removed from patients were placed in 1% sodium dodecyl sulfate solution and randomly divided for electrolysis with 7.5% sodium bicarbonate in the following three different apparatuses (N = 30): two stainless steel electrodes (group I), a copper electrode and a carbon electrode (group II), and two carbon electrodes (group III). The samples were placed on cathode or anode with different electric current (0.5, 1, and 1.5 A) under constant 10 V for 5 min. Electrolyte pH before and after electrolysis were measured. Then, the samples were stained with phloxine B and photographed. The proportion of stained areas was calculated. The surface was examined with a scanning electron microscope (SEM) and energy-dispersive X-ray spectroscopy (EDS).
Electrolyte pH decreased after electrolysis at 1 A and 1.5 A in group I and II. Applying cathode at 1 A in group III, the amount of residual contamination was the lowest in all the conditions examined in the present study. SEM images revealed that applying cathode at 1.5 A in group I induced a rough surface from the smooth surface before the treatment. EDS analysis confirmed that the surfaces treated on cathode at 1 A in group III revealed no signs of organic contamination.
Electrolysis of using carbon as electrodes, placing the contaminated healing abutments on cathode, and applying the electric current of 1 A at constant 10 V in 7.5% sodium bicarbonate could completely remove organic contaminants from the surfaces. This optimized electrochemical cleaning method seems to be well worth investigation for the clinical management of peri-implant infections.
评估电解对清洁受污染愈合基台表面的效果,并检测清洁受污染愈合基台的最佳条件。
将从患者身上取下的90个愈合基台置于1%十二烷基硫酸钠溶液中,并随机分为三组(N = 30),在以下三种不同装置中用7.5%碳酸氢钠进行电解:两个不锈钢电极(第一组)、一个铜电极和一个碳电极(第二组)以及两个碳电极(第三组)。样品在恒定10V电压下,以不同电流(0.5、1和1.5A)置于阴极或阳极上5分钟。测量电解前后电解质的pH值。然后,用焰红B对样品进行染色并拍照。计算染色区域的比例。用扫描电子显微镜(SEM)和能量色散X射线光谱仪(EDS)检查表面。
第一组和第二组在1A和1.5A电流下电解后电解质pH值降低。在第三组中,以1A电流置于阴极时,在本研究检测的所有条件下残留污染量最低。SEM图像显示,第一组在1.5A电流下置于阴极处理后,表面从光滑变为粗糙。EDS分析证实,第三组在1A电流下置于阴极处理的表面没有有机污染迹象。
以碳为电极进行电解,将受污染的愈合基台置于阴极,并在7.5%碳酸氢钠中以恒定10V施加1A电流,可以完全去除表面的有机污染物。这种优化的电化学清洁方法对于种植体周围感染的临床管理似乎很值得研究。