Xu Yingchao, Wang Tianxiao, Guo Yunting, Li Guangyu, Lian Jianshe
Key Laboratory of Automobile Materials, Ministry of Education, College of Materials Science and Engineering, Jilin University, Changchun 130025, China.
Langmuir. 2020 Nov 24;36(46):13937-13948. doi: 10.1021/acs.langmuir.0c02442. Epub 2020 Nov 10.
The excellent biocompatibility of calcium phosphate (CaP) coatings makes them widely used in magnesium (Mg) alloy orthopedic implant materials. However, the porous morphology of CaP coatings limits their corrosion resistance. A cupric oxide (CuO) doped titania (TiO) sol-gel coating is prepared on a porous hydroxyapatite (HA) coating. According to electrochemical test results, the HA/CuO-TiO coating obtains a current density of 6 × 10 mA/cm, lower than that of the Mg alloy (2.6 × 10 mA/cm). The hydrogen evaluation of the HA/CuO-TiO coating is only 1/12 that of the Mg alloy after immersion for 7 days. In addition, the HA/CuO-TiO coating has an antibacterial rate of 99.5 ± 0.4% against , significantly higher than that of the HA coating (19.8 ± 0.3%) and HTC0 coating (38.4 ± 0.5%). The CuO doped composite coating has no adverse effect or cytotoxicity on cell proliferation (cell viability ≥79.6%). Hence, the HA/CuO-TiO composite coating is useful for enhancing the corrosion resistance and antibacterial properties of Mg alloys while ensuring cytocompatibility. The HA/CuO-TiO coated AZ60 Mg alloy can meet the requirements of clinical application.
磷酸钙(CaP)涂层优异的生物相容性使其广泛应用于镁(Mg)合金骨科植入材料中。然而,CaP涂层的多孔形态限制了其耐腐蚀性。在多孔羟基磷灰石(HA)涂层上制备了氧化铜(CuO)掺杂的二氧化钛(TiO)溶胶 - 凝胶涂层。根据电化学测试结果,HA/CuO - TiO涂层的电流密度为6×10 mA/cm,低于镁合金(2.6×10 mA/cm)。浸泡7天后,HA/CuO - TiO涂层的析氢量仅为镁合金的1/12。此外,HA/CuO - TiO涂层对[此处原文缺失具体细菌名称]的抗菌率为99.5±0.4%,显著高于HA涂层(19.8±0.3%)和HTC0涂层(38.4±0.5%)。CuO掺杂的复合涂层对细胞增殖没有不良影响或细胞毒性(细胞活力≥79.6%)。因此,HA/CuO - TiO复合涂层在确保细胞相容性的同时,有助于提高镁合金的耐腐蚀性和抗菌性能。HA/CuO - TiO涂层的AZ60镁合金能够满足临床应用的要求。