Lin Ting, Wu Yuchen, Santos Elizabeth, Chen Xiaoyun, Ahn Dongchan, Mohler Carol, Chen Zhan
Department of Chemistry, University of Michigan, Ann Arbor, Michigan 48109, United States.
Department of Macromolecular Science and Engineering, University of Michigan, Ann Arbor, Michigan 48109, United States.
Langmuir. 2020 Dec 15;36(49):15128-15140. doi: 10.1021/acs.langmuir.0c02719. Epub 2020 Dec 6.
Silicone adhesives are widely used in many important applications in aviation, automotive, construction, and electronics industries. The mixture of (3-glycidoxypropyl)trimethoxysilane (γ-GPS) and hydroxy-terminated dimethyl methylvinyl co-siloxanol (DMMVS) has been widely used as an adhesion promoter in silicone elastomers to enhance the adhesion between silicone and other materials including polymers. The interfacial molecular structures of silicone elastomers and the adhesion promotion mechanisms of a γ-GPS-DMMVS mixture in silicone without a filler or an adhesion catalyst (AC) have been extensively investigated using sum frequency generation (SFG) vibrational spectroscopy previously. In this research, SFG was applied to study interfacial structures of silicone elastomeric adhesives in the presence of a silica filler and/or a zirconium(IV) acetylacetonate adhesion catalyst at the silicone/polyethylene terephthalate (PET) interface nondestructively to understand their individual and synergy effects. The interfacial structures obtained from the SFG study were correlated to the adhesion behavior to PET. The interfacial reactions of methoxy and epoxy groups of the adhesion promoter were found to play significant roles in enhancing the interfacial adhesion of the buried interface. This research provides an in-depth molecular-level understanding on the effects of a filler and an adhesion catalyst on the interfacial behavior of the adhesion promotion system for silicone elastomers as well as the related impact on adhesion.
有机硅粘合剂广泛应用于航空、汽车、建筑和电子行业的许多重要应用中。(3-缩水甘油氧基丙基)三甲氧基硅烷(γ-GPS)和羟基封端的二甲基甲基乙烯基共聚硅氧烷(DMMVS)的混合物已被广泛用作有机硅弹性体中的粘合促进剂,以增强有机硅与包括聚合物在内的其他材料之间的粘附力。此前,已使用和频振动光谱(SFG)对无填料或粘合催化剂(AC)的有机硅弹性体的界面分子结构以及γ-GPS-DMMVS混合物在有机硅中的粘合促进机理进行了广泛研究。在本研究中,应用SFG无损研究了在二氧化硅填料和/或乙酰丙酮锆(IV)粘合催化剂存在下,有机硅弹性体粘合剂在有机硅/聚对苯二甲酸乙二酯(PET)界面的界面结构,以了解它们的单独作用和协同作用。通过SFG研究获得的界面结构与对PET的粘附行为相关。发现粘合促进剂的甲氧基和环氧基的界面反应在增强掩埋界面的界面粘附中起重要作用。本研究提供了对填料和粘合催化剂对有机硅弹性体粘合促进体系界面行为的影响以及对粘附力的相关影响的深入分子水平理解。