Zhang Fengyin, Feng Huijun, Chen Lingen, You Jiang, Xie Zhihui
Institute of Thermal Science and Power Engineering, Wuhan Institute of Technology, Wuhan 430205, China.
School of Mechanical & Electrical Engineering, Wuhan Institute of Technology, Wuhan 430205, China.
Entropy (Basel). 2020 Apr 20;22(4):475. doi: 10.3390/e22040475.
A heat conduction model with an arrow-shaped high thermal conductivity channel (ASHTCC) in a square heat generation body (SHGB) is established in this paper. By taking the minimum maximum temperature difference (MMTD) as the optimization goal, constructal designs of the ASHTCC are conducted based on single, two, and three degrees of freedom optimizations under the condition of fixed ASHTCC material. The outcomes illustrate that the heat conduction performance (HCP) of the SHGB is better when the structure of the ASHTCC tends to be flat. Increasing the thermal conductivity ratio and area fraction of the ASHTCC material can improve the HCP of the SHGB. In the discussed numerical examples, the MMTD obtained by three degrees of freedom optimization are reduced by 8.42% and 4.40%, respectively, compared with those obtained by single and two degrees of freedom optimizations. Therefore, three degrees of freedom optimization can further improve the HCP of the SHGB. Compared the HCPs of the SHGBs with ASHTCC and the T-shaped one, the MMTD of the former is reduced by 13.0%. Thus, the structure of the ASHTCC is proven to be superior to that of the T-shaped one. The optimization results gained in this paper have reference values for the optimal structure designs for the heat dissipations of various electronic devices.
本文建立了一个在方形发热体(SHGB)中带有箭形高导热通道(ASHTCC)的热传导模型。以最小最大温差(MMTD)为优化目标,在ASHTCC材料固定的条件下,基于单自由度、双自由度和三自由度优化对ASHTCC进行构型设计。结果表明,当ASHTCC的结构趋于扁平状时,SHGB的热传导性能(HCP)更好。提高ASHTCC材料的热导率比和面积分数可以改善SHGB的HCP。在所讨论的数值例子中,与单自由度和双自由度优化得到的MMTD相比,三自由度优化得到的MMTD分别降低了8.42%和4.40%。因此,三自由度优化可以进一步改善SHGB的HCP。将带有ASHTCC的SHGB和带有T形通道的SHGB的HCP进行比较,前者的MMTD降低了13.0%。因此,ASHTCC的结构被证明优于T形结构。本文获得的优化结果对各种电子设备散热的最优结构设计具有参考价值。