Piroozan Nariman, Sahimi Muhammad
Mork Family of Department of Chemical Engineering and Materials Science, University of Southern California, Los Angeles, CA, 90089-1211, USA.
Sci Rep. 2020 Dec 17;10(1):22264. doi: 10.1038/s41598-020-79383-y.
It is generally believed that earthquakes occur when faults weaken with increasing slip rates. An important factor contributing to this phenomenon is the faults' dynamic friction, which may be reduced during earthquakes with high slip rates, a process known as slip-rate weakening. It has been hypothesized that the weakening phenomenon during fault slip may be activated by thermal pressurization of pores' fluid and flash heating, a microscopic phenomenon in which heat is generated at asperity contacts due to high shear slip rates. Due to low thermal conductivity of rock, the heat generated at the contact points or surfaces cannot diffuse fast enough, thus concentrating at the contacts, increasing the local contact temperature, and reducing its frictional shear strength. We report the results of what we believe to be the first molecular scale study of the decay of the interfacial friction force in rock, observed in experiemntal studies and attributed to flash heating. The magnitude of the reduction in the shear stress and the local friction coefficients have been computed over a wide range of shear velocities V. The molecular simulations indicate that as the interfacial temperature increases, bonds between the atoms begin to break, giving rise to molecular-scale fracture that eventually produces the flash heating effect. The frequency of flash heating events increases with increasing sliding velocity, leaving increasingly shorter times for the material to relax, hence contributing to the increased interfacial temperature. If the material is thin, the heat quickly diffuses away from the interface, resulting in sharp decrease in the temperature immediately after flash heating. The rate of heat transfer is reduced significantly with increasing thickness, keeping most of the heat close to the interface and producing weakened material. The weakening behavior is demonstrated by computing the stress-strain diagram. For small strain rates there the frictional stress is essentially independent of the materials' thickness. As the strain rate increases, however, the dependence becomes stronger. Specifically, the stress-strain diagrams at lower velocities V manifest a pronounced strength decrease over small distances, whereas they exhibit progressive increase in the shear stress at higher V, which is reminiscent of a transition from ductile behavior at high velocities to brittle response at low velocities.
一般认为,当地层随着滑动速率增加而弱化时,地震就会发生。导致这种现象的一个重要因素是地层的动摩擦,在高滑动速率的地震过程中,动摩擦可能会降低,这一过程被称为滑动速率弱化。据推测,断层滑动过程中的弱化现象可能是由孔隙流体的热增压和闪热激活的,闪热是一种微观现象,由于高剪切滑动速率,在粗糙接触处产生热量。由于岩石的热导率低,在接触点或表面产生的热量不能足够快地扩散,因此集中在接触处,提高局部接触温度,并降低其摩擦剪切强度。我们报告了我们认为是首次在实验研究中观察到并归因于闪热的岩石界面摩擦力衰减的分子尺度研究结果。在很宽的剪切速度V范围内,计算了剪应力和局部摩擦系数的减小幅度。分子模拟表明,随着界面温度升高,原子间的键开始断裂,产生分子尺度的破裂,最终产生闪热效应。闪热事件的频率随着滑动速度的增加而增加,使材料松弛的时间越来越短,从而导致界面温度升高。如果材料很薄,热量会迅速从界面扩散出去,导致闪热后温度立即急剧下降。随着厚度增加,传热速率显著降低,使大部分热量靠近界面,并产生弱化材料。通过计算应力应变图来证明弱化行为。对于小应变率,摩擦应力基本上与材料厚度无关。然而,随着应变率增加,这种依赖性变得更强。具体来说,在较低速度V下的应力应变图在小距离内显示出明显的强度降低,而在较高V下则显示出剪应力逐渐增加,这让人想起从高速下的延性行为到低速下的脆性响应转变。