Zhang Chi, Huang Rongjin, Wang Ping, Wang Yongguang, Zhou Zhengrong, Zhang Hengcheng, Wu Zhixiong, Li Laifeng
State Key Laboratory of Technologies in Space Cryogenic Propellants, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China.
Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China.
ACS Appl Mater Interfaces. 2020 Dec 30;12(52):58170-58178. doi: 10.1021/acsami.0c19628. Epub 2020 Dec 18.
Carbon-based aerogels have drawn substantial attention for a wide scope of applications. However, the high intrinsic electrical conductivity limits their potential thermal management application in electronic packaging materials. Herein, a highly compressible, thermally conductive, yet electrically insulating fluorinated graphene aerogel (FGA) is developed through a hydrofluoric acid-assisted hydrothermal process. The macroscopic-assembled FGA constituting of tailored interconnected graphene networks with tunable fluorine coverage shows excellent elasticity and fatigue resistance for compression, despite a low density of 10.6 mg cm. Moreover, the aerogel is proved to be highly insulating, with the observed lowest electrical conductivity reaching 4 × 10 S cm. Meanwhile, the aerogel exhibits prominent heat dissipation performance in a typical cooling procedure, which can be used to fabricate thermoconductive polymer composites for electronic packaging.
碳基气凝胶因其广泛的应用而备受关注。然而，其高本征电导率限制了它们在电子封装材料中的潜在热管理应用。在此，通过氢氟酸辅助水热法制备了一种具有高压缩性、导热性且电绝缘的氟化石墨烯气凝胶（FGA）。由具有可调氟覆盖率的定制互连石墨烯网络构成的宏观组装FGA，尽管密度低至10.6 mg/cm³，但在压缩时仍表现出出色的弹性和抗疲劳性。此外，该气凝胶被证明具有高度绝缘性，观察到的最低电导率达到4×10⁻⁶ S/cm。同时，该气凝胶在典型的冷却过程中表现出显著的散热性能，可用于制造用于电子封装的导热聚合物复合材料。
