Kozak Maciej, Bejger Artur, Tomczak Arkadiusz
Faculty of Mechatronics and Electrical Engineering, Maritime University of Szczecin, Wały Chrobrego 1-2, 70-500 Szczecin, Poland.
Faculty of Mechanical Engineering, Maritime University of Szczecin, Wały Chrobrego 1-2, 70-500 Szczecin, Poland.
Sensors (Basel). 2020 Dec 24;21(1):70. doi: 10.3390/s21010070.
Modern seagoing ships are often equipped with converters which utilize semiconductor power electronics devices like thyristors or power transistors. Most of them are used in driving applications such as powerful main propulsion plants, auxiliary podded drives and thrusters. When it comes to main propulsion drives the power gets seriously high, thus the need for use of medium voltage power electronics devices arises. As it turns out, power electronic parts are the most susceptible to faults or failures in the whole electric drive system. These devices require efficient cooling, so manufacturers design housings in a way that best dissipates heat from the inside of the chips to the metal housing. This results in susceptibility to damage due to the heterogeneity of combined materials and the difference in temperature expansion of elements inside the power device. Currently used methods of prediction of damage and wear of semiconductor elements are limited to measurements of electrical quantities generated by devices during operation and not quite effective in case of early-stage damage to semiconductor layers. The article presents an introduction and preliminary tests of a method utilizing an acoustic emission sensor which can be used in detecting early stage damages of the gate turn-off thyristor. Theoretical considerations and chosen experimental results of initial measurements of acoustic emission signals of the medium voltage gate turn-off thyristor are presented.
现代海船通常配备有转换器,这些转换器利用晶闸管或功率晶体管等半导体电力电子器件。其中大多数用于驱动应用,如强大的主推进装置、辅助吊舱式驱动器和推进器。对于主推进驱动器而言,功率会变得非常高,因此需要使用中压电力电子器件。事实证明,电力电子部件在整个电力驱动系统中最容易出现故障或失效。这些器件需要高效散热,所以制造商在设计外壳时,要以能将芯片内部的热量最有效地散发到金属外壳的方式进行。这导致由于组合材料的异质性以及功率器件内部元件的温度膨胀差异而容易受到损坏。目前用于预测半导体元件损坏和磨损的方法仅限于测量器件在运行期间产生的电量,并且在半导体层早期损坏的情况下效果不太理想。本文介绍了一种利用声发射传感器的方法,并进行了初步测试,该方法可用于检测门极可关断晶闸管的早期损坏。文中给出了中压门极可关断晶闸管声发射信号初始测量的理论考量和部分实验结果。