Kim Dasom, Kim Kyungju, Kwon Hansang
Department of Materials System Engineering, Pukyong National University, Busan 48547, Korea.
The Industrial Science Technology Research Center, Pukyong National University, Busan 48547, Korea.
Materials (Basel). 2021 Jan 7;14(2):266. doi: 10.3390/ma14020266.
Al-Cu matrix composites with excellent mechanical and thermal properties are among the most promising materials for realising high performance in thermal management systems. However, intermetallic compounds (ICs) formed at the Al/Cu interfaces prevent direct contact between the metals and severely deteriorate the thermal conductivity of the composite. In this study, we systemically investigated the formation behaviour of Al-Cu ICs as a function of compaction pressure at a low temperature of 380 °C. The phases of the Al-Cu ICs formed during sintering were detected via X-ray diffraction, and the layer thickness and average area fraction of each IC at different compaction pressures were analysed via micro-scale observations of the cross-sections of the Al-Cu composites. The ICs were partially formed along the Al/Cu interfaces at high pressures, and the formation region was related to the direction of applied pressure. The Vickers hardness of the Al-Cu composites with ICs was nearly double those calculated using the rule of mixtures. On the other hand, the thermal conductivity of the composites increased with compaction pressure and reached 201 W·m·K. This study suggests the possibility of employing Al-Cu matrix composites with controlled IC formation in thermal management applications.
具有优异机械和热性能的铝铜基复合材料是实现热管理系统高性能最有前途的材料之一。然而，在铝/铜界面形成的金属间化合物（ICs）阻碍了金属之间的直接接触，并严重降低了复合材料的热导率。在本研究中，我们系统地研究了在380°C低温下，铝铜ICs的形成行为与压实压力的关系。通过X射线衍射检测烧结过程中形成的铝铜ICs的相，并通过对铝铜复合材料横截面的微观观察分析不同压实压力下各ICs的层厚和平均面积分数。在高压下，ICs部分沿铝/铜界面形成，形成区域与施加压力的方向有关。含有ICs的铝铜复合材料的维氏硬度几乎是根据混合法则计算值的两倍。另一方面，复合材料的热导率随压实压力的增加而增加，达到201W·m·K。本研究表明，在热管理应用中采用可控IC形成的铝铜基复合材料具有可能性。
