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采用响应面法优化浮选浸出工艺从废印刷电路板中回收铜。

Copper recovery from waste printed circuit boards by the flotation-leaching process optimized using response surface methodology.

机构信息

School of Chemical Engineering, Zhengzhou University, Zhengzhou, People's Republic of China.

Henan Key Laboratory of Coal Green Conversion, College of Chemistry and Chemical Engineering, Henan Polytechnic University, Jiaozuo, People's Republic of China.

出版信息

J Air Waste Manag Assoc. 2021 Dec;71(12):1483-1491. doi: 10.1080/10962247.2021.1874568. Epub 2021 Sep 24.

Abstract

Recycling of waste printed circuit boards (PCBs) receives increasing attention due to abundant metallic resources and significant environmental threats. This work proposes a process for copper recovery from PCBs by froth flotation and oxidation leaching. Copper grade is improved from 38.70% to 68.34% with the recovery of 88.76% by froth flotation, and froth flotation is significantly influenced by copper liberation and particles dispersion of PCB powders. Process variables of oxidation leaching are examined by response surface methodology (RSM). A reliable mathematical model is obtained to predict the response as a function of independent variables and their interactions. Oxidation leaching is remarkably influenced by experimental variables, and the interactions between sulfuric acid and hydrogen peroxide are significant. Optimum conditions are achieved as sulfuric acid 1.0 mol/L, hydrogen peroxide 17%, temperature 50°C, and time 234 minutes, and the maximum leaching ratio of Cu is up to 99.94%, indicating that oxidation leaching is an effective method for Cu recovery from PCBs.: Recycling of waste printed circuit boards (PCBs) receives increasing attention due to abundant metallic resources and significant environmental threats. This work proposes a novel process for copper recovery from PCBs by froth flotation and oxidation leaching. Froth flotation is efficient to enrich copper in metal fractions. Process variables of oxidation leaching are examined by response surface methodology (RSM). A reliable mathematical model is obtained to predict the response as a function of independent variables and their interactions. The froth flotation-oxidation leaching process is practicable and effective for copper recovery from waste printed circuit boards. This study significantly contributes to recycling metal resources from waste PCBs. We believe that this work will attract a broad readership and lead others to follow our approach.

摘要

由于丰富的金属资源和重大的环境威胁,废弃印刷电路板(PCB)的回收受到越来越多的关注。本工作提出了一种从 PCB 中通过泡沫浮选和氧化浸出回收铜的方法。通过泡沫浮选,铜品位从 38.70%提高到 68.34%,回收率为 88.76%,而泡沫浮选的效果显著受到 PCB 粉末中铜的解离和颗粒分散的影响。通过响应面法(RSM)考察了氧化浸出的工艺变量。获得了一个可靠的数学模型,可以预测响应作为独立变量及其相互作用的函数。氧化浸出受到实验变量的显著影响,硫酸和过氧化氢之间的相互作用是显著的。最佳条件为硫酸 1.0 mol/L、过氧化氢 17%、温度 50°C 和时间 234 分钟,铜的最大浸出率达到 99.94%,表明氧化浸出是从 PCB 中回收铜的有效方法。

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