Agarwal Nikita, Bansal Sanchit, Pai Umesh Yeshwanth, Rodrigues Shobha J, Shetty Thilak B, Saldanha Sharon J
Department of Prosthodontics, Manipal College of Dental Sciences, Manipal Academy of Higher Education, Mangalore, Karnataka, India.
J Indian Prosthodont Soc. 2020 Oct-Dec;20(4):363-370. doi: 10.4103/jips.jips_443_19. Epub 2020 Oct 8.
This study assessed the effect of postetch cleansing on the surface microstructure, surface topography, and microshear bond strength (μSBS) of lithium disilicate and the resin cement.
analytical study.
Fifteen discs (10 mm diameter and 2 mm thickness) were fabricated from highly translucent lithium disilicate IPS Emax 2 ceramic (Ivoclar Vivadent, Schaan, Liechtenstein). Four resin cement (RelyX Ultimate, 3M ESPE) cylinders (0.9 mm diameter and 4 mm high) were placed on each ceramic disc (total = 60). The samples were divided into three groups based on the surface treatment of the ceramic discs (20 resin cement cylinders on 5 discs in each group). Group I (HF) (control) etched with 9.6% HF with no postetch cleansing, Group II (HFP) etched with 9.6% HF for 20 s followed by rinsing with water and postetching cleansing with 37% phosphoric acid, and Group III (HFPU) etched with 9.6% HF followed by active application of 37% phosphoric acid followed by postetch cleansing in ultrasonic bath for 5 min. μSBS of resin cement to ceramic surfaces was tested following a standard protocol. Surface roughness was evaluated using an atomic force microscope. Surface topography and elemental analysis were analyzed using SEM/EDX. Mode of failure was also assessed.
The data were analysed using one way analysis of variance and post hoc tukeys test.
The μSBS were found to be highest for Group III (HFPU), followed by Group II (HFP) followed by Group I (HF) and were statistically significant. There was a difference in the surface topography and surface microstructure between the three groups. Mode of failure was predominantly adhesive.
The μSBS, surface topography, and surface microstructure were found to be superior in the groups, in which postetch cleansing was done as compared to the control in which no postetch cleansing was done.
本研究评估酸蚀后清洁对二硅酸锂及树脂水门汀的表面微观结构、表面形貌和微剪切粘结强度（μSBS）的影响。
分析性研究。
用高透二硅酸锂IPS Emax 2陶瓷（义获嘉伟瓦登特公司，沙恩，列支敦士登）制作15个圆盘（直径10 mm，厚2 mm）。在每个陶瓷圆盘上放置4个树脂水门汀（RelyX Ultimate，3M ESPE）圆柱体（直径0.9 mm，高4 mm）（共60个）。根据陶瓷圆盘的表面处理方式将样本分为三组（每组5个圆盘上有20个树脂水门汀圆柱体）。第一组（HF）（对照组）用9.6%氢氟酸蚀刻，不进行酸蚀后清洁；第二组（HFP）用9.6%氢氟酸蚀刻20秒，然后用水冲洗，再用37%磷酸进行酸蚀后清洁；第三组（HFPU）用9.6%氢氟酸蚀刻，接着主动施加37%磷酸，然后在超声浴中进行酸蚀后清洁5分钟。按照标准方案测试树脂水门汀与陶瓷表面的μSBS。使用原子力显微镜评估表面粗糙度。用扫描电子显微镜/能谱仪（SEM/EDX）分析表面形貌和元素分析。还评估了失效模式。
数据采用单因素方差分析和事后检验的Tukey检验进行分析。
发现第三组（HFPU）的μSBS最高，其次是第二组（HFP），然后是第一组（HF），且具有统计学意义。三组之间的表面形貌和表面微观结构存在差异。失效模式主要为粘结性。
与未进行酸蚀后清洁的对照组相比，进行了酸蚀后清洁的组在μSBS、表面形貌和表面微观结构方面表现更优。
