Ungaro Craig, Kaliteevskiy Nikolay, Sterlingov Petr, Ivanov Viacheslav V, Boh Ruffin A, Terbrueggen Ralf J, Savidis Nickolaos
Appl Opt. 2021 Jan 20;60(3):714-719. doi: 10.1364/AO.413306.
Ultrafast laser cutting of a glass substrate at an oblique angle is demonstrated using a phase-corrected Bessel beam. Simulations are used to predetermine the ideal phase of the incident Bessel beam such that an unaberrated Bessel beam is formed inside the tilted substrate. Additional corrections to the beam such as shortening, moving the intensity of the beam within the substrate, and the formation of an elliptical focal spot were necessary to ensure consistent chamfering of the substrate and are discussed herein. Three cuts are combined to create a damage tract in the glass substrate in the shape of a chamfer, and then the glass is separated using a laser resulting in a chamfered edge.
利用相位校正的贝塞尔光束演示了在倾斜角度下对玻璃基板进行超快激光切割。通过模拟来预先确定入射贝塞尔光束的理想相位，以便在倾斜的基板内部形成无像差的贝塞尔光束。为确保基板的倒角一致，还需要对光束进行额外的校正，如缩短光束、在基板内移动光束强度以及形成椭圆形焦点，本文将对此进行讨论。通过三次切割在玻璃基板上形成一个倒角形状的损伤轨迹，然后使用激光将玻璃分离，从而得到一个倒角边缘。
