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通过导热反应性液晶基元和储热液晶基元的组合实现热能收集与再利用

Thermal Energy Harvest and Reutilization by the Combination of Thermal Conducting Reactive Mesogens and Heat-Storage Mesogens.

作者信息

Kang Dong-Gue, Park Minwook, Ko Hyeyoon, Rim Minwoo, Park Sungjune, Tran Duy Thanh, Yoo Myong-Jae, Kim Namil, Jeong Kwang-Un

机构信息

Department of Polymer-Nano Science and Technology, Department of Nano Convergence Engineering, Jeonbuk National University, Jeonju 54896, Republic of Korea.

Department of Chemistry and Biochemistry, University of California, Santa Barbara 93106, California, United States.

出版信息

ACS Appl Mater Interfaces. 2021 Mar 24;13(11):13637-13647. doi: 10.1021/acsami.0c21730. Epub 2021 Mar 11.

DOI:10.1021/acsami.0c21730
PMID:33703879
Abstract

Utilizing a newly programmed and synthesized heat storage mesogen (HSM) and reactive mesogen (RM), advanced heat managing polymer alloys that exhibit high thermal conductivity, high latent heat, and phase transition at high temperatures were developed for use as smart thermal energy harvesting and reutilization materials. The RM in the heat-managing RM-HSM polymer alloy was polymerized to form a robust polymeric network with high thermal conductivity. The phase-separated HSM domains between RM polymeric networks absorbed and released a lot of thermal energy in response to changes in the surrounding temperature. For the fabrication of smart heat-managing RM-HSM polymer alloys, the composition and polymerization temperature were optimized based on the constructed phase diagram and thermal energy managing properties of the RM-HSM mixture. From morphological investigation and thermal analysis, it was realized that the heat storage capacity of polymer alloys depends on the size of the phase-separated HSM domain. The structure-morphology-property relationship of the heat managing polymer alloys was built based on the combined techniques of thermal, scattering, and morphological analysis. The newly developed mesogen-based polymer alloys can be used as smart thermal energy-harvesting and reutilization materials.

摘要

利用新编程合成的储热液晶基元(HSM)和反应性液晶基元(RM),开发了具有高导热性、高潜热和高温下相变特性的先进热管理聚合物合金,用作智能热能收集和再利用材料。热管理RM-HSM聚合物合金中的RM发生聚合,形成具有高导热性的坚固聚合物网络。RM聚合物网络之间相分离的HSM域会根据周围温度的变化吸收和释放大量热能。为了制备智能热管理RM-HSM聚合物合金,基于构建的相图和RM-HSM混合物的热能管理特性对组成和聚合温度进行了优化。通过形态学研究和热分析发现,聚合物合金的储热能力取决于相分离HSM域的大小。基于热分析、散射分析和形态分析等综合技术,建立了热管理聚合物合金的结构-形态-性能关系。新开发的基于液晶基元的聚合物合金可作为智能热能收集和再利用材料。

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