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韧性热电材料α-AgS中本征缺陷的形成及过渡金属掺杂对输运性质的影响:第一性原理研究

Intrinsic defect formation and the effect of transition metal doping on transport properties in a ductile thermoelectric material α-AgS: a first-principles study.

作者信息

Ngoc Nam Ho, Yamada Ryo, Okumura Haruki, Nguyen Tien Quang, Suzuki Katsuhiro, Shinya Hikari, Masago Akira, Fukushima Tetsuya, Sato Kazunori

机构信息

Department of Precision Science and Technology, Graduate School of Engineering, Osaka University, 2-1 Yamadaoka, Suita, Osaka 565-0871, Japan.

出版信息

Phys Chem Chem Phys. 2021 Apr 28;23(16):9773-9784. doi: 10.1039/d0cp06624a.

Abstract

In this paper, the electronic structure and transport properties of a ductile thermoelectric material α-Ag2S are examined using first-principles calculations combined with the Boltzmann transport equation within a constant relaxation-time approximation. The use of the exchange-correlation functional SCAN + rVV10 successfully describes the geometric and electronic structure of α-Ag2S with a direct bandgap value of 0.99 eV, which is consistent with the previous experimental observations. Based on the calculations of the formation energy of typical intrinsic defects, it is found that intrinsic defect formation greatly affects the conductivity of the system where silver vacancy and interstitial silver act as p-type and n-type defects, respectively. Large Seebeck coefficients at room-temperature, of around -760 μV K-1 for n-type and 1400 μV K-1 for p-type, are realized. It is also suggested that the doping of fully filled d-block elements such as Cu and Au not only maintained the Seebeck coefficients at high values but also improved electrical conductivity by more than 1.4 times, leading to the improvement of the power factor by up to 40% compared to the non-doped sample at low carrier concentration.

摘要

在本文中,采用第一性原理计算结合玻尔兹曼输运方程,并在恒定弛豫时间近似下,研究了一种韧性热电材料α-Ag₂S的电子结构和输运性质。交换关联泛函SCAN + rVV10的使用成功地描述了α-Ag₂S的几何和电子结构,其直接带隙值为0.99 eV,这与先前的实验观察结果一致。基于典型本征缺陷形成能的计算,发现本征缺陷的形成对体系的电导率有很大影响,其中银空位和间隙银分别作为p型和n型缺陷。在室温下实现了较大的塞贝克系数,n型约为-760 μV K⁻¹,p型约为1400 μV K⁻¹。还表明,掺杂如Cu和Au等全充满d块元素不仅能将塞贝克系数保持在较高值,还能使电导率提高超过1.4倍,与低载流子浓度下的未掺杂样品相比,功率因数提高了高达40%。

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