Faculty of Dentistry, Oral & Craniofacial Sciences, King's College London, London, United Kingdom.
Department of Restorative Dentistry, Faculty of Dentistry, University of Debrecen, Nagyerdei krt. 98., H4032, Debrecen, Hungary.
J Dent. 2021 May;108:103637. doi: 10.1016/j.jdent.2021.103637. Epub 2021 Mar 22.
To evaluate the effect of different adhesive protocols on the microtensile bond strength (μTBS) and integrity of the repaired bulk fill composite interface.
Two hundred and seventy composite blocks made of bulk fill composites of different viscosity were randomly assigned to 18 surface conditioning groups (n = 15/group). The universal adhesive systems used were Heliobond™, Tokuyama bond force II™ and Scotchbond Universal™. A nanohybrid resin composite was applied as the repair material. Negative and positive control groups were included. Stick shape specimens of each group were subjected to μTBS testing. Representative samples from all test groups were subjected to microscopic, profilometric and SEM examination to determine their mode of failure. The data were analysed statistically using two-way ANOVA test, Tukey's test and the independent t-test (α = 0.05).
The mean μTBS of all test groups ranged between 28.5 and 46.8 MPa and varied with the type of adhesive system employed. Significantly highest μTBS values were obtained when Tokuyama bond force II™ and Scotchbond Universal™ adhesives were used (p < 0.01) which were comparable to the coherent strength of the bulk fill resin composite in the positive control groups (p > 0.05). The viscosity of the bulk fill composite did not significantly influence repair bond strength. The microscopy and SEM examination of the failed interfaces revealed a mixture of adhesive and cohesive failures.
Under the tested conditions, significantly greater μTBS of repaired bulk fill composite was achieved when the substrate surface was treated with adhesive systems containing a functional monomer.
Eff ;ecting a repair of a bulk fill resin composite restoration with the application of a functional monomer containing adhesive system, such as Tokuyama Bond Force II™ or Scotchbond Universal™, would seem to enhance the interfacial bond strength and integrity of the repaired resin composite interface.
评估不同粘接方案对大体积充填复合树脂修复体界面微拉伸粘接强度（μTBS）和完整性的影响。
将 270 个由不同粘度的大体积充填复合材料制成的复合块随机分配到 18 个表面处理组（n = 15/组）。使用的通用粘接系统是 Heliobond™、Tokuyama bond force II™ 和 Scotchbond Universal™。应用纳米混合树脂复合材料作为修复材料。包括阴性和阳性对照组。每组的棒状试件均进行 μTBS 测试。所有测试组的代表性样本均进行微观、轮廓和 SEM 检查，以确定其失效模式。使用双向方差分析检验、Tukey 检验和独立 t 检验（α = 0.05）对数据进行统计分析。
所有测试组的平均 μTBS 值在 28.5 至 46.8 MPa 之间，且随所使用的粘接系统类型而变化。当使用 Tokuyama bond force II™ 和 Scotchbond Universal™ 粘接剂时，获得的 μTBS 值显著更高（p < 0.01），与阳性对照组中大体积充填树脂复合材料的内聚强度相当（p > 0.05）。大体积充填复合材料的粘度对修复粘接强度没有显著影响。对失效界面的显微镜和 SEM 检查显示出混合的粘接和内聚失效。
在测试条件下，当基底表面用含有官能单体的粘接系统处理时，大体积充填复合材料的修复体获得了显著更高的 μTBS。
应用含有官能单体的粘接系统，如 Tokuyama Bond Force II™ 或 Scotchbond Universal™，对大体积充填树脂复合材料修复体进行修复，似乎可以增强修复树脂复合材料界面的界面粘接强度和完整性。
