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用于可拉伸多层和多材料电子与传感器系统的弹性体复合材料的电镀与烧蚀激光结构化

Electroplating and Ablative Laser Structuring of Elastomer Composites for Stretchable Multi-Layer and Multi-Material Electronic and Sensor Systems.

作者信息

Stier Simon P, Böse Holger

机构信息

Center Smart Materials and Adaptive Systems, Fraunhofer Institute for Silicate Research ISC, 97082 Würzburg, Germany.

出版信息

Micromachines (Basel). 2021 Mar 3;12(3):255. doi: 10.3390/mi12030255.

DOI:10.3390/mi12030255
PMID:33802335
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC7999256/
Abstract

In this work we present the concept of electroplated conductive elastomers and ablative multi-layer and multi-material laser-assisted manufacturing to enable a largely automated, computer-aided manufacturing process of stretchable electronics and sensors. Therefore, the layers (conductive and non-conductive elastomers as well as metal layers for contacting) are first coated over the entire surface (doctor blade coating and electroplating) and then selectively removed with a CO or a fiber laser. These steps are repeated several times to achieve a multi-layer-structured design. Is it not only possible to adjust and improve the work previously carried out manually, but also completely new concepts such as fine through-plating between the layers to enable much more compact structures become possible. In addition, metallized areas allow the direct soldering of electronic components and thus a direct connection between conventional and stretchable electronics. As an exemplary application, we have used the process for manufacturing a thin and surface solderable pressure sensor with a silicone foam dielectric and a stretchable circuit board.

摘要

在这项工作中,我们提出了电镀导电弹性体以及烧蚀性多层和多材料激光辅助制造的概念,以实现可拉伸电子器件和传感器的高度自动化、计算机辅助制造过程。因此,各层(导电和非导电弹性体以及用于连接的金属层)首先在整个表面上进行涂覆(刮刀法涂覆和电镀),然后用CO2或光纤激光器进行选择性去除。这些步骤重复多次以实现多层结构设计。这不仅能够调整和改进之前手动进行的工作,还使诸如层间精细通孔电镀等全新概念成为可能,从而实现更加紧凑的结构。此外,金属化区域允许电子元件直接焊接,进而实现传统电子器件与可拉伸电子器件之间的直接连接。作为一个示例性应用,我们已将该工艺用于制造具有硅泡沫电介质和可拉伸电路板的薄型且可表面焊接的压力传感器。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/0a9b20083982/micromachines-12-00255-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/5144f29025f9/micromachines-12-00255-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/009f8c475ded/micromachines-12-00255-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/39c6737656f0/micromachines-12-00255-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/014c4860f5eb/micromachines-12-00255-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/2aacccd0b931/micromachines-12-00255-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/a64eb02e893b/micromachines-12-00255-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/63e7535c7fdc/micromachines-12-00255-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/3b9a1e48a5ff/micromachines-12-00255-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/0a9b20083982/micromachines-12-00255-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/5144f29025f9/micromachines-12-00255-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/009f8c475ded/micromachines-12-00255-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/39c6737656f0/micromachines-12-00255-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/014c4860f5eb/micromachines-12-00255-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/2aacccd0b931/micromachines-12-00255-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/a64eb02e893b/micromachines-12-00255-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/63e7535c7fdc/micromachines-12-00255-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/3b9a1e48a5ff/micromachines-12-00255-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/bfbd/7999256/0a9b20083982/micromachines-12-00255-g009.jpg

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