Lee Bo-Young, Lee Dae-Hyeon, Jang Keon-Soo
Department of Polymer Engineering, School of Chemical and Materials Engineering, The University of Suwon, Hwaseong 18323, Korea.
Polymers (Basel). 2021 Apr 2;13(7):1129. doi: 10.3390/polym13071129.
Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing agents. The curing, deoxidizing, thermal, and rheological properties were systematically investigated. For uniform film formation and maximizing deoxidizing curable abilities, a thermoplastic--thermoset mixture containing a phenyl and carboxylic acid-based additive (benzoic acid), and a polycarbonate was chosen as the model adhesive film. Without either a phenyl or an acidic group in the compatibilizing agent, deoxidizing and compatibilizing effects were not achieved. The manufactured hybrid adhesive film can be effectively used, especially for electronic devices that require deoxidization and adhesion.
含有酸性化合物的环氧树脂具有粘附性、坚固性和脱氧能力。在本研究中，制备了具有脱氧和固化能力的用于半导体封装的混合粘合剂薄膜。主要通过使用各种添加剂粘合剂（热塑性无定形聚合物）和增容剂来研究增容效果和机械性能。对固化、脱氧、热和流变性能进行了系统研究。为了实现均匀成膜并最大化脱氧固化能力，选择了一种含有苯基和羧酸基添加剂（苯甲酸）以及聚碳酸酯的热塑性-热固性混合物作为模型粘合剂薄膜。如果增容剂中既没有苯基也没有酸性基团，则无法实现脱氧和增容效果。所制造的混合粘合剂薄膜可有效应用，特别是对于需要脱氧和粘附的电子设备。
