Yallur Basappa C, Krishna P Murali, Challa Malathi
Department of Chemistry, Ramaiah Institute of Technology, Bangalore, 560054, India.
Heliyon. 2021 Apr 22;7(4):e06838. doi: 10.1016/j.heliyon.2021.e06838. eCollection 2021 Apr.
The present work describes the preparation of bivalent Ni(II), Co(II) and Cu(II) complexes of [(E)-[(2-methyl-1,3-thiazol-5-yl)methylidene]amino]thiourea (MTHC) by mixing in 1:2 ratio of corresponding metal salt and Schiff base ligand in ethanolic medium. The prepared ligand and its complexes are confirmed using elemental analysis, magnetic moments, FT-IR, NMR, electronic and ESR spectroscopy techniques. The spectroscopic data reveals that metal complexes are in square planar in nature. In DNA binding studies, the higher intrinsic binding constants (K) of Ni(II), Co(II) and Cu(II) complexes are 2.713 × 10 M, 5.529 × 10 M and 2.950 × 10 M respectively, evident that complexes are avid binder with DNA base pairs. The moderate anti-bacterial activity (in-vitro) against bacterial culture may be due to the high electron density of ligand which prevents the charge reduction of metal ion. In the presence and absence of HO it is notified that there is no appreciable DNA cleavage activity of Ni(II) and Co(II) complexes except Cu(II) complex which is due to aprotonation in the medium.
本研究描述了通过在乙醇介质中以1:2的比例混合相应的金属盐和席夫碱配体[(E)-[(2-甲基-1,3-噻唑-5-基)亚甲基]氨基]硫脲(MTHC)来制备二价镍(II)、钴(II)和铜(II)配合物。使用元素分析、磁矩、傅里叶变换红外光谱(FT-IR)、核磁共振(NMR)、电子光谱和电子顺磁共振(ESR)光谱技术对所制备的配体及其配合物进行了确认。光谱数据表明,金属配合物本质上为平面正方形结构。在DNA结合研究中,镍(II)、钴(II)和铜(II)配合物的较高固有结合常数(K)分别为2.713×10 M、5.529×10 M和2.950×10 M,这表明配合物是与DNA碱基对的 avid 结合剂。对细菌培养物的适度抗菌活性(体外)可能是由于配体的高电子密度阻止了金属离子的电荷降低。在有和没有过氧化氢的情况下,发现除了铜(II)配合物外,镍(II)和钴(II)配合物没有明显的DNA切割活性,这是由于介质中的去质子化作用。