Shin Soowon, Ha Yoonhee, Choi Gwangjin, Hyun Junewoo, Kim Sangwoo, Oh Seung-Ha, Min Kyou-Sik
TODOC Co., Ltd., Seoul 08394, Korea.
Department of Otorhinolaryngology, Seoul National University Hospital, Seoul 03080, Korea.
Micromachines (Basel). 2021 Jun 30;12(7):778. doi: 10.3390/mi12070778.
(1) Background: In this study, we introduce a manufacturable 32-channel cochlear electrode array. In contrast to conventional cochlear electrode arrays manufactured by manual processes that consist of electrode-wire welding, the placement of each electrode, and silicone molding over wired structures, the proposed cochlear electrode array is manufactured by semi-automated laser micro-structuring and a mass-produced layer-by-layer silicone deposition scheme similar to the semiconductor fabrication process. (2) Methods: The proposed 32-channel electrode array has 32 electrode contacts with a length of 24 mm and 0.75 mm spacing between contacts. The width of the electrode array is 0.45 mm at its apex and 0.8 mm at its base, and it has a three-layered arrangement consisting of a 32-channel electrode layer and two 16-lead wire layers. To assess its feasibility, we conducted an electrochemical evaluation, stiffness measurements, and insertion force measurements. (3) Results: The electrochemical impedance and charge storage capacity are 3.11 ± 0.89 kOhm at 1 kHz and 5.09 mC/cm2, respectively. The V/H ratio, which indicates how large the vertical stiffness is compared to the horizontal stiffness, is 1.26. The insertion force is 17.4 mN at 8 mm from the round window, and the maximum extraction force is 61.4 mN. (4) Conclusions: The results of the preliminary feasibility assessment of the proposed 32-channel cochlear electrode array are presented. After further assessments are performed, a 32-channel cochlear implant system consisting of the proposed 32-channel electrode array, 32-channel neural stimulation and recording IC, titanium-based hermetic package, and sound processor with wireless power and signal transmission coil will be completed.
(1) 背景:在本研究中,我们介绍了一种可制造的32通道耳蜗电极阵列。与传统的通过手工工艺制造的耳蜗电极阵列不同,传统工艺包括电极丝焊接、每个电极的放置以及在有线结构上进行硅胶成型,所提出的耳蜗电极阵列是通过半自动激光微结构化和类似于半导体制造工艺的大规模逐层硅胶沉积方案制造的。(2) 方法:所提出的32通道电极阵列有32个电极触点,长度为24毫米,触点之间的间距为0.75毫米。电极阵列在其顶端的宽度为0.45毫米,在其基部的宽度为0.8毫米,它具有由32通道电极层和两个16引线层组成的三层结构。为了评估其可行性,我们进行了电化学评估、刚度测量和插入力测量。(3) 结果:在1 kHz时,电化学阻抗和电荷存储容量分别为3.11±0.89 kΩ和5.09 mC/cm²。V/H比(表示垂直刚度与水平刚度相比有多大)为1.26。在距圆窗8毫米处的插入力为17.4 mN,最大拔出力为61.4 mN。(4) 结论:给出了所提出的32通道耳蜗电极阵列初步可行性评估的结果。在进行进一步评估后,将完成一个由所提出的32通道电极阵列、32通道神经刺激和记录集成电路、钛基密封封装以及带有无线电力和信号传输线圈的声音处理器组成的32通道耳蜗植入系统。