Suppr超能文献

单体基因组分析揭示了四个参与高温适应的基因串联簇。

Haploid Genome Analysis Reveals a Tandem Cluster of Four Genes Involved in the High-Temperature Adaptation of .

机构信息

Institute of Bioengineering, Guangdong Academy of Sciences, Guangzhou, People's Republic of China.

Key Laboratory of Quality Evaluation of Chinese Medicine of the Guangdong Provincial Medical Products Administration, the Second Clinical College, Guangzhou University of Chinese Medicine, Guangzhou, People's Republic of China.

出版信息

Microbiol Spectr. 2021 Sep 3;9(1):e0028721. doi: 10.1128/Spectrum.00287-21. Epub 2021 Aug 18.

Abstract

Coriolopsis trogii is a typical thermotolerant basidiomycete fungus, but its thermotolerance mechanisms are currently unknown. In this study, two monokaryons of C. trogii strain Ct001 were assembled: Ct001_29 had a genome assembly size of 38.85 Mb and encoded 13,113 genes, while Ct001_31 was 40.19 Mb in length and encoded 13,309 genes. Comparative intra- and interstrain genomic analysis revealed the rich genetic diversity of , which included more than 315,194 single-nucleotide polymorphisms (SNPs), 30,387 insertion/deletions (indels), and 1,460 structural variations. Gene family analysis showed that the expanded families of were functionally enriched in lignocellulose degradation activities. Furthermore, a total of 14 allelic pairs of heat shock protein 20 () genes were identified in the genome. The expression profile obtained from RNA sequencing (RNA-Seq) showed that four tandem-duplicated allelic pairs, to , had more than 5-fold higher expression at 35°C than at 25°C. In particular, and were the most highly expressed genes. Allelic expression bias was found for and ; the expression of was at least 1.34-fold higher than that of , and that of was at least 1.5-fold higher than that of . The unique structural and expression profiles of the genes revealed by these haplotype-resolved genomes provide insight into the molecular mechanisms of high-temperature adaptation in . Heat stress is one of the most frequently encountered environmental stresses for most mushroom-forming fungi. Currently available fungal genomes are mostly haploid because high heterozygosity hinders diploid genome assembly. Here, two haplotype genomes of , a thermotolerant basidiomycete, were assembled separately. A conserved tandem cluster of four genes showing allele-specific expression was found to be closely related to high-temperature adaptation in . The obtained haploid genomes and their comparison offer a more thorough understanding of the genetic background of . In addition, the responses of genes at 35°C, which may contribute to the growth and survival of at high temperatures, could inform the selection and breeding of elite strains in the future.

摘要

硫色多孔菌是一种典型的耐热担子真菌,但它的耐热机制目前尚不清楚。在这项研究中,组装了硫色多孔菌菌株 Ct001 的两个单核体:Ct001_29 的基因组组装大小为 38.85Mb,编码 13113 个基因,而 Ct001_31 的长度为 40.19Mb,编码 13309 个基因。比较种内和种间基因组分析揭示了 的丰富遗传多样性,其中包括超过 315194 个单核苷酸多态性(SNP)、30387 个插入/缺失(indel)和 1460 个结构变异。基因家族分析表明, 的扩展家族在木质纤维素降解活性中具有功能富集。此外,在 基因组中共鉴定出 14 对热休克蛋白 20(HSP20)基因的等位基因对。从 RNA 测序(RNA-Seq)获得的表达谱显示,在 35°C 下,四个串联重复的等位基因对 到 ,其表达水平比在 25°C 下高出 5 倍以上。特别是 和 是表达最高的 HSP20 基因。发现了 和 之间的等位基因表达偏倚; 的表达至少是 的 1.34 倍, 的表达至少是 的 1.5 倍。这些单倍型解析基因组揭示的 HSP20 基因的独特结构和表达谱为了解 在高温适应中的分子机制提供了线索。

热应激是大多数蕈类真菌最常遇到的环境压力之一。目前可用的真菌基因组大多是单倍体,因为高度杂合性阻碍了二倍体基因组的组装。在这里,组装了耐热担子菌硫色多孔菌的两个单倍型基因组。发现一个保守的四联体 HSP20 基因簇具有等位基因特异性表达,与 在高温适应中密切相关。获得的单倍型基因组及其比较为 提供了更深入的遗传背景理解。此外,在 35°C 下,可能有助于 在高温下生长和存活的 HSP20 基因的反应,可以为未来的优良菌株的选择和培育提供信息。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/3d3e/8552761/e0577306cf05/spectrum.00287-21-f001.jpg

文献AI研究员

20分钟写一篇综述,助力文献阅读效率提升50倍。

立即体验

用中文搜PubMed

大模型驱动的PubMed中文搜索引擎

马上搜索

文档翻译

学术文献翻译模型,支持多种主流文档格式。

立即体验