Xu Xiuwen, Qian Wei, Wang Jian, Yang Jiecheng, Chen Jianwei, Xiao Shuang, Ge Yongshuai, Yang Shihe
Guangdong Key Lab of Nano-Micro Material Research, School of Chemical Biology and Biotechnology, Shenzhen Graduate School, Peking University, Shenzhen, 518055, China.
Institute of Biomedical Engineering, Shenzhen Bay Laboratory, Shenzhen, 518055, China.
Adv Sci (Weinh). 2021 Nov;8(21):e2102730. doi: 10.1002/advs.202102730. Epub 2021 Sep 8.
Perovskite materials in different dimensions show great potential in direct X-ray detection, but each with limitations stemming from its own intrinsic properties. Particularly, the sensitivity of two-dimensional (2D) perovskites is limited by poor carrier transport while ion migration in three-dimensional (3D) perovskites causes the baseline drifting problem. To circumvent these limitations, herein a double-layer perovskite film is developed with properly aligned energy level, where 2D (PEA) MA Pb I (PEA=2-phenylethylammonium, MA=methylammonium) is cascaded with vertically crystallized 3D MAPbI . In this new design paradigm, the 3D layer ensures fast carrier transport while the 2D layer mitigates ion migration, thus offering a high sensitivity and a greatly stabilized baseline. Besides, the 2D layer increases the film resistivity and enlarges the energy barrier for hole injection without compromising carrier extraction. Consequently, the double-layer perovskite detector delivers a high sensitivity (1.95 × 10 μC Gy cm ) and a low detection limit (480 nGy s ). Also demonstrated is the X-ray imaging capacity using a circuit board as the object. This work opens up a new avenue for enhancing X-ray detection performance via cascade assembly of various perovskites with complementary properties.
不同维度的钙钛矿材料在直接X射线检测中显示出巨大潜力,但每种材料都因其自身固有特性而存在局限性。特别是,二维(2D)钙钛矿的灵敏度受到载流子传输不良的限制,而三维(3D)钙钛矿中的离子迁移会导致基线漂移问题。为了克服这些限制,本文开发了一种具有适当对齐能级的双层钙钛矿薄膜,其中二维(PEA)MA Pb I(PEA = 2-苯乙铵,MA = 甲铵)与垂直结晶的三维MAPbI层叠。在这种新的设计范式中,三维层确保快速载流子传输,而二维层减轻离子迁移,从而提供高灵敏度和高度稳定的基线。此外,二维层提高了薄膜电阻率并扩大了空穴注入的能垒,而不会影响载流子提取。因此,双层钙钛矿探测器具有高灵敏度(1.95×10 μC Gy cm )和低检测限(480 nGy s )。还展示了以电路板为对象的X射线成像能力。这项工作通过级联组装具有互补特性的各种钙钛矿,为提高X射线检测性能开辟了一条新途径。