Liu Chenhan, Lu Ping, Chen Weiyu, Zhao Yunshan, Chen Yunfei
Engineering Laboratory for Energy System Process Conversion & Emission Reduction Technology of Jiangsu Province, School of Energy and Mechanical Engineering, Nanjing Normal University, Nanjing, 210042, P. R. China.
Jiangsu Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, School of Mechanical Engineering, Southeast University, Nanjing, 211100, P. R. China.
Phys Chem Chem Phys. 2021 Dec 1;23(46):26030-26060. doi: 10.1039/d1cp02328d.
Graphene, due to its atomic layer structure, has the highest room temperature thermal conductivity for all known materials. Thus, it is expected that graphene based materials are the best candidates for thermal management in next generation electronic devices. In this perspective, we first review the in-plane of monolayer graphene and multilayer graphene obtained using experimental measurements, theoretical calculations and molecular dynamics (MD) simulations. Considering the importance of four-phonon scattering in graphene, we also compare the effects of three-phonon and four-phonon scattering on phonon transport in graphene. Then, we review phonon transport along the cross-plane direction of multilayer graphene and highlight that the cross-plane phonon mean free path is several hundreds of nanometers instead of a few nanometers as predicted using classical kinetic theory. Recently, hydrodynamic phonon transport has been observed experimentally in graphitic materials. The criteria for distinguishing the hydrodynamic from ballistic and diffusive regimes are discussed, from which we conclude that graphene based materials with a high Debye temperature and high anharmonicity (due to ZA modes) are excellent candidates to observe the hydrodynamic phonon transport. In the fourth part, we review how to actively control phonon transport in graphene. Graphene and graphite are often adopted as additives in thermal management materials such as polymer nanocomposites and thermal interface materials due to their high . However, the enhancement of the composite's is not so high as expected because of the large thermal resistance between graphene sheets as well as between the graphene sheet and matrix. In the fifth part, we discuss the interfacial thermal resistance and analyze its effect on the thermal conductivity of graphene based materials. In the sixth part, we give a brief introduction to the applications of graphene based materials in thermal management. Finally, we conclude our review with some perspectives for future research.
由于其原子层结构，石墨烯在所有已知材料中具有最高的室温热导率。因此，预计基于石墨烯的材料是下一代电子器件热管理的最佳候选材料。从这个角度来看，我们首先回顾了使用实验测量、理论计算和分子动力学（MD）模拟获得的单层石墨烯和多层石墨烯的面内热导率。考虑到四声子散射在石墨烯中的重要性，我们还比较了三声子和四声子散射对石墨烯中声子输运的影响。然后，我们回顾了多层石墨烯沿横截面方向的声子输运，并强调横截面声子平均自由程为数百纳米，而不是经典动力学理论预测的几纳米。最近，在石墨材料中通过实验观察到了流体动力学声子输运。讨论了区分流体动力学与弹道和扩散区域的标准，由此我们得出结论，具有高德拜温度和高非谐性（由于ZA模式）的基于石墨烯的材料是观察流体动力学声子输运的优秀候选材料。在第四部分中，我们回顾了如何主动控制石墨烯中的声子输运。由于石墨烯和石墨具有高的热导率，它们经常被用作聚合物纳米复合材料和热界面材料等热管理材料中的添加剂。然而，由于石墨烯片之间以及石墨烯片与基体之间的大热阻，复合材料的热导率增强并不像预期的那么高。在第五部分中，我们讨论了界面热阻并分析了其对基于石墨烯的材料热导率的影响。在第六部分中，我们简要介绍了基于石墨烯的材料在热管理中的应用。最后，我们以对未来研究的一些展望结束我们的综述。
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