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与短路汞合金和金合金电极之间电荷转移相关的锡和铜释放。

Tin and copper release related to charge transfer between short-circuited amalgam and gold alloy electrodes.

作者信息

Johansson B I

出版信息

Scand J Dent Res. 1986 Jun;94(3):259-66. doi: 10.1111/j.1600-0722.1986.tb01762.x.

Abstract

Short-circuited electrodes of dental amalgams and a gold alloy were used in an attempt to study a possible relationship between the quantity of copper and tin ions released into an electrolyte and the charge transferred between the electrodes. It was found that under the experimental conditions used the quantity of tin ions released was related to the charge transferred between the conventional amalgam and the gold alloy. The same tendency was found using a saliva sample which confined and collected the released tin ions into a small volume when the conventional amalgam specimen was short-circuited to the gold alloy specimen in vivo.

摘要

使用牙科汞合金和一种金合金的短路电极,试图研究释放到电解质中的铜离子和锡离子的量与电极之间转移的电荷之间可能存在的关系。结果发现,在所使用的实验条件下,释放的锡离子量与传统汞合金和金合金之间转移的电荷有关。当传统汞合金标本在体内与金合金标本短路时,使用唾液样本也发现了相同的趋势,该唾液样本将释放的锡离子限制并收集到小体积中。

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