Karim Syed Shujaat, Murtaza Zahid, Farrukh Sarah, Umer Malik Adeel, Ali Syed Sarim, Younas Mohammad, Mubashir Muhammad, Saqib Sidra, Ayoub Muhammad, Bokhari Awais, Peter Angela Paul, Khoo Kuan Shiong, Ullah Sami, Show Pau Loke
Department of Chemical Engineering, School of Chemical and Materials Engineering (SCME), National University of Sciences and Technology (NUST), Sector H-12, Islamabad, Pakistan.
Department of Chemical Engineering, School of Chemical and Materials Engineering (SCME), National University of Sciences and Technology (NUST), Sector H-12, Islamabad, Pakistan.
Environ Res. 2022 Apr 1;205:112402. doi: 10.1016/j.envres.2021.112402. Epub 2021 Nov 25.
The emerging growth of the electronic devices applications has arisen the serious problems of electromagnetic (EM) wave pollution which resulting in equipment malfunction. Therefore, polymer-based composites have been considered good candidates for better EMI shielding due to their significant characteristics including, higher flexibility, ultrathin, lightweight, superior conductivity, easy fabrication processing, environmentally friendly, corrosion resistive, better adhesion with physical, chemical and thermal stability. This review article focused on the concept of the EMI shielding mechanism and challenges with the fabrication of polymer-based composites. Subsequently, recent advancements in the polymer composites applications have been critically reviewed. In addition, the impact of polymers and polymer nanocomposites with different fillers such as organic, inorganic, 2D, 3D, mixture and hybrid nano-fillers on EMI shielding effectiveness has been explored. Lastly, future research directions have been proposed to overcome the limitations of current technologies for further advancement in EMI shielding materials for industrial applications. Based on reported literature, it has been found that the low thickness based lightweight polymer is considered as a best material for excellent material for next-generation electronic devices. Optimization of polymer composites during the fabrication is required for better EMI shielding. New nano-fillers such as functionalization and composite polymers are best to enhance the EMI shielding and conductive properties.
电子设备应用的迅速发展引发了严重的电磁波污染问题,导致设备故障。因此,基于聚合物的复合材料因其显著特性,如更高的柔韧性、超薄、轻质、优异的导电性、易于加工、环保、耐腐蚀、与物理、化学和热稳定性的良好附着力,被认为是更好的电磁干扰屏蔽材料的理想候选者。这篇综述文章聚焦于电磁干扰屏蔽机制的概念以及基于聚合物的复合材料制造过程中的挑战。随后,对聚合物复合材料应用的最新进展进行了批判性综述。此外,还探讨了聚合物和聚合物纳米复合材料与不同填料(如有机、无机、二维、三维、混合和杂化纳米填料)对电磁干扰屏蔽效能的影响。最后,提出了未来的研究方向,以克服当前技术的局限性,推动用于工业应用的电磁干扰屏蔽材料的进一步发展。根据已发表的文献,发现低厚度的轻质聚合物被认为是下一代电子设备的最佳材料。为了实现更好的电磁干扰屏蔽,在制造过程中需要对聚合物复合材料进行优化。新型纳米填料,如功能化和复合聚合物,最有利于提高电磁干扰屏蔽和导电性能。