新型低温共烧陶瓷（LTCC）和高温共烧陶瓷（HTCC）功率模块互连的金属化、材料选择与键合

Metallization, Material Selection, and Bonding of Interconnections for Novel LTCC and HTCC Power Modules.

作者信息

Sešek Aleksander, Makarovič Kostja

机构信息

Faculty of Electrical Engineering, University of Ljubljana, Tržaška Cesta 25, SI-1000 Ljubljana, Slovenia.

KEKO Equipment, Grajski Trg 15, SI-8360 Žužemberk, Slovenia.

出版信息

Materials (Basel). 2022 Jan 28;15(3):1036. doi: 10.3390/ma15031036.

DOI:10.3390/ma15031036

PMID:35160980

原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8839124/

Abstract

Ceramic baseplates are important elements in the power modules of electric drives. This paper presents low-temperature cofired ceramic (LTCC) and high-temperature cofired ceramic (HTCC) materials for the fabrication of three-dimensional power modules. The silver-based metallization and power module assembly are presented, together with aluminum-based power wire bonding and an industrial procedure to achieve high solderability and bondability. The results of the bond tests using different metallization materials, especially cost-effective ones, are presented, together with the assembly of the power modules. The best results were achieved with Ag metallization and 380 µm Al wire and with Ag-Pd metallization and 25 µm Al wire, both on an LTCC base. The paper concludes with a dual-pulse electrical test of the power modules, which proves the quality of metallization, the type of material selected, and the correctness of the wire bonding and assembly.

摘要

陶瓷基板是电力驱动功率模块中的重要元件。本文介绍了用于制造三维功率模块的低温共烧陶瓷（LTCC）和高温共烧陶瓷（HTCC）材料。阐述了银基金属化和功率模块组装，以及铝基功率引线键合和实现高可焊性与可键合性的工业流程。展示了使用不同金属化材料（尤其是具有成本效益的材料）进行键合测试的结果以及功率模块的组装情况。在LTCC基板上，采用Ag金属化和380 µm铝线以及Ag-Pd金属化和25 µm铝线均取得了最佳结果。本文最后对功率模块进行了双脉冲电气测试，证明了金属化质量、所选材料类型以及引线键合和组装的正确性。