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通过熔融共混加盐沥滤法制备的轻质聚乙烯/六方氮化硼复合导热材料

Lightweight Polyethylene/Hexagonal Boron Nitride Hybrid Thermal Conductor Fabricated by Melt Compounding Plus Salt Leaching.

作者信息

Pi He-Jie, Liu Xiao-Xiao, Liao Jian-Yu, Zhou Yue-Yun, Meng Cong

机构信息

College of Urban and Environment Sciences, Hunan University of Technology, 88 Taishan Road, Zhuzhou 412007, China.

Hunan Provincial Key Laboratory of Comprehensive Utilization of Agricultural and Animal Husbandry Waste Resources, Hunan University of Technology, 88 Taishan Road, Zhuzhou 412007, China.

出版信息

Polymers (Basel). 2022 Feb 22;14(5):852. doi: 10.3390/polym14050852.

DOI:10.3390/polym14050852
PMID:35267675
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8912592/
Abstract

Application of porous polymeric materials is severely limited by their ultralow thermal conductivities. Herein, by promoting the formation of thermal conduction pathways, we fabricated open-cellular structured polyethylene/hexagonal boron nitride hybrid thermal conductors via melt compounding plus salt leaching. The structural analyses indicate that the inclusion of hBN can enhance the open-cell level of resultant materials. X-ray diffractions confirm the high in-plane alignments of hBN in each sample. Consequently, the test results evidence the superior thermal conductivities of our samples, and the thermal conductivities of each sample are characterized as functions of hBN loadings. Ultimately, our advanced porous thermal conductor with a low hBN loading of 3.1 vol% exhibits a high specific thermal conductivity of 0.75 (W/mk)/(g/cm), which is 82.9% higher than virgin PE and far higher than bulk PE/hBN composites. Our work also intends to reveal the architectural advantages of open-cellular, as compared with the close-one, in fabricating porous materials with highly interconnected fillers.

摘要

多孔聚合物材料的应用因其超低的热导率而受到严重限制。在此,通过促进热传导路径的形成,我们通过熔融共混加盐沥滤制备了开孔结构的聚乙烯/六方氮化硼混合热导体。结构分析表明,hBN的加入可以提高所得材料的开孔率。X射线衍射证实了每个样品中hBN的高面内取向。因此,测试结果证明了我们样品具有优异的热导率,并且每个样品的热导率被表征为hBN负载量的函数。最终,我们先进的多孔热导体在hBN负载量低至3.1 vol%时,表现出0.75 (W/mk)/(g/cm)的高比热导率,比纯PE高82.9%,且远高于块状PE/hBN复合材料。我们的工作还旨在揭示与闭孔结构相比,开孔结构在制备具有高度互连填料的多孔材料方面的结构优势。

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本文引用的文献

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Thermal and Adhesion Properties of Fluorosilicone Adhesives Following Incorporation of Magnesium Oxide and Boron Nitride of Different Sizes and Shapes.添加不同尺寸和形状的氧化镁和氮化硼后氟硅酮胶粘剂的热性能和粘附性能
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Recent Progress in Conducting Polymer Composite/Nanofiber-Based Strain and Pressure Sensors.
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Thermally Conductive Shape Memory Polymer Composites Filled with Boron Nitride for Heat Management in Electrical Insulation.用于电绝缘热管理的氮化硼填充导热形状记忆聚合物复合材料
Polymers (Basel). 2021 Jun 30;13(13):2191. doi: 10.3390/polym13132191.
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3D Lamellar-Structured Graphene Aerogels for Thermal Interface Composites with High Through-Plane Thermal Conductivity and Fracture Toughness.用于具有高面内热导率和断裂韧性的热界面复合材料的3D层状结构石墨烯气凝胶
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