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放电等离子烧结SiC-TiB-TiC粉末的加工与表征

Processing and Characterization of Spark Plasma Sintered SiC-TiB-TiC Powders.

作者信息

Grigoriev Sergey N, Pristinskiy Yuri, Soe Thet Naing, Malakhinsky Alexander, Mosyanov Mikhail, Podrabinnik Pavel, Smirnov Anton, Solís Pinargote Nestor Washington

机构信息

Laboratory of Electric Current Assisted Sintering Technologies, Moscow State University of Technology "STANKIN", Vadkovsky per. 1, 127055 Moscow, Russia.

Department of High-Efficiency Machining Technologies, Moscow State University of Technology "STANKIN", Vadkovsky per. 1, 127055 Moscow, Russia.

出版信息

Materials (Basel). 2022 Mar 5;15(5):1946. doi: 10.3390/ma15051946.

DOI:10.3390/ma15051946
PMID:35269178
原文链接:https://pmc.ncbi.nlm.nih.gov/articles/PMC8911810/
Abstract

SiC-TiB-TiC composites with matrices consisting of semiconductor material (SiC), conductive materials (TiB-TiC), or their combination were fabricated by spark plasma sintering (SPS) at 2000 °C in a vacuum under a pressure of 80 MPa for 3 min. The composition and microstructure of the obtained composites were studied by X-ray diffraction and a scanning electron microscope equipped with an energy-dispersive detector. The flexural strength, Vickers hardness, and fracture toughness of SPSed samples were determined. Based on the observations in this work, three variations of the sintering process were proposed with different matrix compositions. The dense (99.7%) 60SiC-25TiB-15TiC vol.% sintered ceramic composites exhibited the highest strength and hardness values of the studied composites, as well as a fracture toughness of 6.2 MPa·m.

摘要

通过在真空中于2000°C、80 MPa压力下进行3分钟的放电等离子烧结（SPS），制备了基体由半导体材料（SiC）、导电材料（TiB - TiC）或它们的组合构成的SiC - TiB - TiC复合材料。通过X射线衍射和配备能谱探测器的扫描电子显微镜研究了所得复合材料的组成和微观结构。测定了经SPS处理样品的抗弯强度、维氏硬度和断裂韧性。基于本工作中的观察结果，针对不同的基体组成提出了三种烧结工艺变体。致密（99.7%）的60SiC - 25TiB - 15TiC体积%烧结陶瓷复合材料在研究的复合材料中表现出最高的强度和硬度值，以及6.2 MPa·m的断裂韧性。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/88730151ba95/materials-15-01946-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/f5bc7f65acec/materials-15-01946-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/e8e28330c0a2/materials-15-01946-g002.jpg
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https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/2699c75fa74b/materials-15-01946-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/27f28fe0e26e/materials-15-01946-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/84f18024bdad/materials-15-01946-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/98848abf70f6/materials-15-01946-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/88730151ba95/materials-15-01946-g010.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/f5bc7f65acec/materials-15-01946-g001.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/e8e28330c0a2/materials-15-01946-g002.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/f27e132a168d/materials-15-01946-g003.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/08e7b21a37d2/materials-15-01946-g004.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/329817dd4c72/materials-15-01946-g005.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/2699c75fa74b/materials-15-01946-g006.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/27f28fe0e26e/materials-15-01946-g007.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/84f18024bdad/materials-15-01946-g008.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/98848abf70f6/materials-15-01946-g009.jpg
https://cdn.ncbi.nlm.nih.gov/pmc/blobs/0b20/8911810/88730151ba95/materials-15-01946-g010.jpg

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