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从非氰化物镀金溶液中光催化回收金制备金纳米颗粒修饰的半导体

Photocatalytic Recovery of Gold from a Non-Cyanide Gold Plating Solution as Au Nanoparticle-Decorated Semiconductors.

作者信息

Kunthakudee Naphaphan, Puangpetch Tarawipa, Ramakul Prakorn, Hunsom Mali

机构信息

Department of Chemical Engineering, Faculty of Engineering, Mahidol University, Nakhon Pathom 73170, Thailand.

Department of Chemical Engineering, Faculty of Engineering and Industrial Technology, Silpakorn University, Nakhon Pathom 73000, Thailand.

出版信息

ACS Omega. 2022 Feb 21;7(9):7683-7695. doi: 10.1021/acsomega.1c06362. eCollection 2022 Mar 8.

Abstract

In this work, a photocatalytic process was carried out to recover gold (Au) from the simulated non-cyanide plating bath solution. Effects of semiconductor types (TiO, WO, NbO, CeO, and BiO), initial pH of the solution (3-10), and type of complexing agents (NaSO and NaSO) and their concentrations (1-4 mM each) on Au recovery were explored. Among all employed semiconductors, TiO exhibited the highest photocatalytic activity to recover Au from the simulated spent plating bath solution both in the absence and presence of complexing agents, in which Au was completely recovered within 15 min at a pH of 6.5. The presence of complexing agents remarkably affected the size of deposited Au on the TiO surface, the localized surface plasmon effect (LSPR) behavior, and the valence band (VB) edge position of the obtained Au/TiO, without a significant change in the textural properties or the band gap energy. The photocatalytic activity of the obtained Au/TiO tested via two photocatalytic processes depended on the common reduction mechanism rather than the textural or optical properties. As a result, the Au/TiO NPs obtained from the proposed recovery process are recommended for use as a photocatalyst for the reactions occurring at the conduction band rather than at the valence band. Notably, they exhibited good stability after the fifth photocatalytic cycle for Au recovery from the actual cyanide plating bath solution.

摘要

在这项工作中,进行了光催化过程以从模拟的非氰化物镀液中回收金(Au)。研究了半导体类型(TiO、WO、NbO、CeO和BiO)、溶液的初始pH值(3 - 10)、络合剂类型(NaSO和NaSO)及其浓度(各1 - 4 mM)对金回收的影响。在所使用的所有半导体中,TiO在有无络合剂的情况下均表现出最高的光催化活性,可从模拟的废镀液中回收金,其中在pH为6.5时,15分钟内金被完全回收。络合剂的存在显著影响了TiO表面沉积金的尺寸、局域表面等离子体共振效应(LSPR)行为以及所得Au/TiO的价带(VB)边缘位置,而结构性质或带隙能量没有显著变化。通过两种光催化过程测试所得Au/TiO的光催化活性取决于共同的还原机制,而非结构或光学性质。因此,建议将通过所提出的回收过程获得的Au/TiO纳米颗粒用作光催化剂,用于在导带而非价带发生的反应。值得注意的是,它们在从实际氰化物镀液中回收金的第五次光催化循环后表现出良好的稳定性。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/6912/8908523/4999fd7d8cca/ao1c06362_0002.jpg

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