Saeed Noreen
School of Architecture, Carnegie Mellon University, 5000 Forbes Avenue, Pittsburgh, PA 15213, USA.
Data Brief. 2022 Mar 8;42:108027. doi: 10.1016/j.dib.2022.108027. eCollection 2022 Jun.
Empirical data and methods of measurements for the research article "Experimental correlation of thermal conductivity with dielectric properties of wood and wood-based construction materials: Possibilities for rapid in-situ building energy evaluation" by Saeed et al. [1] is presented. The data offers an insight into the possible correlation between thermal conductivity and dielectric properties of wood and wood-based materials. There is independent data on thermal conductivity and dielectric properties of wood in the literature. However, data correlating the two properties is scarce, making our dataset unique. Data on the dielectric properties, thermal conductivity, density, and moisture content of 30 solid wood and 17 wood-based materials is presented. Wood-based materials include plywood, OSB, chipboard, and MDF. Measurements were made on 50 mm x 25 mm samples, typically 25 mm thick. The thermal conductivity was measured using the steady state method with a heat flow meter apparatus. Dielectric properties were measured using an unshielded system of two electrodes with an LCR meter at 10 kHz and 100 kHz frequencies at room temperature. All measurements were made in the transverse direction for solid woods and perpendicular to the face of the boards for wood-based materials.
本文展示了赛义德等人[1]所著研究文章《木材及木质建筑材料热导率与介电性能的实验关联：建筑能耗快速现场评估的可能性》的实证数据及测量方法。这些数据深入揭示了木材及木质材料热导率与介电性能之间可能存在的关联。文献中有关于木材热导率和介电性能的独立数据。然而，将这两种性能关联起来的数据却很稀少，这使得我们的数据集具有独特性。文中给出了30种实木和17种木质材料的介电性能、热导率、密度及含水率数据。木质材料包括胶合板、定向刨花板、刨花板和中密度纤维板。测量是在50毫米×25毫米的样品上进行的，样品厚度通常为25毫米。热导率采用稳态法，使用热流计装置进行测量。介电性能在室温下，使用带有LCR测量仪的双电极非屏蔽系统，在10千赫和100千赫频率下进行测量。所有测量对于实木是在横向进行，对于木质材料是垂直于板材表面进行。
