Kim Myeongjin, Park Hyun Soon
Department of Materials Science and Engineering, Inha University, Incheon, 22212, Republic of Korea.
Appl Microsc. 2022 Mar 28;52(1):2. doi: 10.1186/s42649-022-00071-4.
With the lightening of the mobile devices, thinning of electrolytic copper foil, which is mainly used as an anode collection of lithium secondary batteries, is needed. As the copper foil becomes ultrathin, mechanical properties such as deterioration of elongation rate and tear phenomenon are occurring, which is closely related to microstructure. However, there is a problem that it is not easy to prepare and observe specimens in the analysis of the microstructure of ultrathin copper foil. In this study, electron backscatter diffraction (EBSD) specimens were fabricated using only mechanical polishing to analyze the microstructure of 8 μm thick electrolytic copper foil in plane view. In addition, EBSD maps and transmission electron microscopy (TEM) images were compared and analyzed to find the optimal cleanup technique for properly correcting errors in EBSD maps.
随着移动设备的轻量化，需要使主要用作锂二次电池阳极集流体的电解铜箔变薄。随着铜箔变得超薄，出现了诸如伸长率劣化和撕裂现象等机械性能问题，这与微观结构密切相关。然而，在超薄铜箔微观结构分析中，制备和观察试样并不容易。在本研究中，仅使用机械抛光制备电子背散射衍射（EBSD）试样，以分析8μm厚电解铜箔的平面微观结构。此外，对EBSD图和透射电子显微镜（TEM）图像进行了比较和分析，以找到适当校正EBSD图中误差的最佳清理技术。
