Park Hwanyeol, Woo Daekwang, Lee Jong Myeong, Park Se Jun, Lee Sungwoo, Kim Ho Jun, Yoon Euijoon, Lee Gun-Do
Department of Materials Science and Engineering, Seoul National University Seoul 08826 Korea
Memory Thin Film Technology Team, Giheung Hwaseong Complex, Samsung Electronics 445-701 South Korea.
RSC Adv. 2020 Feb 13;10(12):6822-6830. doi: 10.1039/c9ra09328a.
Amorphous carbon (a-C) films have attracted significant attention due to their reliable structures and superior mechanical, chemical and electronic properties, making them a strong candidate as an etch hard mask material for the fabrication of future integrated semiconductor devices. Density functional theory (DFT) calculations and molecular dynamics (AIMD) simulations were performed to investigate the energetics, structure, and mechanical properties of the a-C films with an increasing sp content by adjusting the atomic density or hydrogen content. A drastic increase in the bulk modulus is observed by increasing the atomic density of the a-C films, which suggests that it would be difficult for the films hardened by high atomic density to relieve the stress of the individual layers within the overall stack in integrated semiconductor devices. However, the addition of hydrogen into the a-C films has little effect on increasing the bulk modulus even though the sp content increases. For the F blocking nature, the change in the sp content by both atomic density and H concentration makes the diffusion barrier against the F atom even higher and suppresses the F diffusion, indicating that the F atom would follow the diffusion path passing through the sp carbon and not the sp carbon due to the significantly high barrier. For the material design of a-C films with adequate doped characteristics, our results can provide a new straightforward strategy to tailor the a-C films with excellent mechanical and other novel physical and chemical properties.
非晶碳(a-C)薄膜因其可靠的结构以及优异的机械、化学和电子性能而备受关注,使其成为未来集成半导体器件制造中蚀刻硬掩膜材料的有力候选者。通过调整原子密度或氢含量,进行了密度泛函理论(DFT)计算和分子动力学(AIMD)模拟,以研究随着sp含量增加的a-C薄膜的能量学、结构和机械性能。通过增加a-C薄膜的原子密度,观察到体积模量急剧增加,这表明通过高原子密度硬化的薄膜很难缓解集成半导体器件中整个堆叠内各层的应力。然而,即使sp含量增加,向a-C薄膜中添加氢对增加体积模量的影响也很小。对于F阻挡性质,原子密度和H浓度引起的sp含量变化使得对F原子的扩散势垒更高,并抑制了F扩散,这表明由于势垒显著较高,F原子将沿着穿过sp碳而非sp²碳的扩散路径扩散。对于具有适当掺杂特性的a-C薄膜的材料设计,我们的结果可以提供一种新的直接策略来定制具有优异机械性能以及其他新颖物理和化学性能的a-C薄膜。