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T形双带隙表面等离激元极化激元传输线及其在微波谐振器中的应用。

T-shaped double-strip spoof surface plasmon polariton transmission lines and application to microwave resonators.

作者信息

Choi Wonseok, Jeong Jinho

机构信息

Department of Electronic Engineering, Sogang University, Seoul, 04107, Korea.

出版信息

Sci Rep. 2022 May 9;12(1):7585. doi: 10.1038/s41598-022-11751-2.

Abstract

A microwave double-strip spoof surface plasmon polariton (DS SSPP) is proposed for high-speed interconnects and high-performance microwave circuits. Based on the dispersion analysis, a T-shaped double-strip structure is designed to provide strong surface- and slow-wave properties from very low to very high frequencies (~ 40 GHz). It allows the tight field confinement and greatly reduces the electromagnetic wave leakage. It exhibits broadband performance with reduced ripples in the insertion loss. It also shows more constant group delay and impedance than counterpart single-strip SSPP. The compact coaxial-to-microstrip-to-DS SSPP transition are designed using gradient grooves. The measurement shows that the DS SSPP lines can exhibit the lower coupling and lower insertion loss than the microstrip lines, so that the former is well-suited for the densely packed high-speed interconnects. The designed DS SSPP is utilized for high quality (Q)-factor microwave ring resonator. The measured unloaded Q-factor is 107.9 at the resonant frequency of 8.7 GHz, which is 1.3 times higher than the microstrip ring resonator. It is found to be caused by the reduction of the radiation loss, according to the loss analysis. The size is also reduced due to the short wavelength, occupying 56.8% of that of the microstrip ring resonator. Therefore, the proposed T-shaped DS SSPP can be also applied for high-performance miniaturized microwave circuits.

摘要

本文提出了一种用于高速互连和高性能微波电路的微波双带隙表面等离激元极化激元(DS SSPP)。基于色散分析,设计了一种T形双带结构,以在从甚低频到甚高频(~40 GHz)范围内提供强大的表面和慢波特性。它允许紧密的场限制,并大大减少电磁波泄漏。它具有宽带性能,插入损耗中的纹波减小。与对应的单带SSPP相比,它还表现出更恒定的群延迟和阻抗。采用渐变槽设计了紧凑的同轴-微带- DS SSPP过渡结构。测量结果表明,DS SSPP线比微带线具有更低的耦合和更低的插入损耗,因此前者非常适合密集封装的高速互连。所设计的DS SSPP用于高品质(Q)因子微波环形谐振器。在8.7 GHz的谐振频率下,测得的空载Q因子为107.9,比微带环形谐振器高1.3倍。根据损耗分析,发现这是由于辐射损耗的降低所致。由于波长较短,尺寸也减小了,占微带环形谐振器尺寸的56.8%。因此,所提出的T形DS SSPP也可应用于高性能小型化微波电路。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/4c1c/9085786/27a6456f832b/41598_2022_11751_Fig1_HTML.jpg

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