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通过纳米粘附测量探究超分子四重氢键模块的单对断裂力。

Probing the single pair rupture force of supramolecular quadruply hydrogen bonding modules by nano-adhesion measurement.

作者信息

Wang Lulu, Yin Zhaoming, Zhang Yagang, Jiang Yingfang, Zhang Letao, Yasin Akram

机构信息

Department of Chemical and Environmental Engineering, Xinjiang Institute of Engineering Urumqi 830023 China

Xinjiang Technical Institute of Physics and Chemistry, Chinese Academy of Sciences Urumqi 830011 China.

出版信息

RSC Adv. 2018 Jun 13;8(39):21798-21805. doi: 10.1039/c8ra03739f.

Abstract

Studying quadruply hydrogen bonding (QHB) module interactions in materials matrices presents a significant challenge because a wide variety of non-covalent interactions may be relevant. Here we introduce a method of surface modification with DeUG (7-deazaguanine urea), DAN (2,7-diamido-1,8-naphthyridine) and UPy (2-ureido-4[1]-pyrimidone) modules to form self-assembled monolayers (SAMs) on a glass surface. The QHB interactions under mechanical stress were investigated by measuring adhesion force using PS-DAN (DAN modified polystyrene), PBMA-DeUG (DeUG modified poly butyl methacrylate) and PBA-UPy (UPy modified poly butyl acrylate) as adhesion promoters. A mechanical lap-shear test was used to evaluate the fracture resistance of QHB heterocomplexes. The maximum load at fail showed that QHB interaction contributed significantly (72%) to overall adhesion. For the QHB modified glass surface, using a polymer modified with its complementary QHB partner greatly facilitated their pairing efficiency, up to 40% for DAN-DeUG. A general method from which single pair ruptures force of QHB modules could be obtained using thermodynamic data obtained from solution chemistry was proposed. Using this method, the single pair rupture force for UPy-UPy was measured as 160 pN, and the single pair rupture force for DAN-DeUG was obtained as 193 pN.

摘要

研究材料基质中的四重氢键(QHB)模块相互作用面临重大挑战,因为可能涉及多种非共价相互作用。在此,我们介绍一种用DeUG(7-脱氮鸟嘌呤尿素)、DAN(2,7-二氨基-1,8-萘啶)和UPy(2-脲基-4[1]-嘧啶酮)模块进行表面改性的方法,以在玻璃表面形成自组装单分子层(SAMs)。通过使用PS-DAN(DAN修饰的聚苯乙烯)、PBMA-DeUG(DeUG修饰的聚甲基丙烯酸丁酯)和PBA-UPy(UPy修饰的聚丙烯酸丁酯)作为粘附促进剂来测量粘附力,研究了机械应力下的QHB相互作用。采用机械搭接剪切试验评估QHB异质复合物的抗断裂性。失效时的最大载荷表明,QHB相互作用对总体粘附力有显著贡献(72%)。对于QHB修饰的玻璃表面,使用与其互补的QHB配体修饰的聚合物极大地促进了它们的配对效率,DAN-DeUG的配对效率高达40%。提出了一种通用方法,可利用从溶液化学获得的热力学数据来获得QHB模块的单对断裂力。使用该方法,测得UPy-UPy的单对断裂力为160 pN,DAN-DeUG的单对断裂力为193 pN。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/f49d/9081402/e9c1fde967bd/c8ra03739f-f1.jpg

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