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耦合辐照处理诱导的聚酰亚胺薄膜的表面表征及降解行为

Surface characterization and degradation behavior of polyimide films induced by coupling irradiation treatment.

作者信息

Dong Shan-Shan, Shao Wen-Zhu, Yang Li, Ye Hui-Jian, Zhen Liang

机构信息

School of Materials Science and Engineering, Harbin Institute of Technology Harbin 150001 China

Institute of Polymer Materials and Engineering, College of Materials Science and Engineering, Zhejiang University of Technology Hangzhou 310001 China.

出版信息

RSC Adv. 2018 Aug 6;8(49):28152-28160. doi: 10.1039/c8ra05744c. eCollection 2018 Aug 2.

Abstract

The degradation behavior of polyimide in extreme environments, especially under coupling treatment, directly determines the service life of several key components in spacecraft. In this research, the combined effect of a high energy electron beam (1.2 MeV), heavy tensile stress (50 MPa) and constant high temperature (150 °C) was taken into account to study the surface modification and degradation behavior of polyimide films. By analyzing surface morphology, microstructural evolution and mechanical behavior of polyimide films after coupling treatment, the results indicated that the coupling treatment led to severe breakage of chemical bonds and decrease of surface quality. Meanwhile, new chemical bonds of C-C, CH-O and C[triple bond, length as m-dash]N formed after coupling treatment. Additionally, a high dose of electron beam during coupling experiments contributed to the formation of an oxide layer, surface defects and even volatile gases in the outer layer of the polyimide film. This was attributed to the significant scissioning of molecular chains in polyimide films and corresponding chemical reactions between free radicals and oxygen in air. Consequently, the irradiation-load-heating coupling treatment led to a remarkable drop in viscoelastic properties and mechanical performance of polyimide films.

摘要

聚酰亚胺在极端环境下,尤其是在耦合处理条件下的降解行为,直接决定了航天器中几个关键部件的使用寿命。在本研究中,考虑了高能电子束(1.2 MeV)、重拉伸应力(50 MPa)和恒定高温(150 °C)的联合作用,以研究聚酰亚胺薄膜的表面改性和降解行为。通过分析耦合处理后聚酰亚胺薄膜的表面形貌、微观结构演变和力学行为,结果表明耦合处理导致化学键严重断裂和表面质量下降。同时,耦合处理后形成了新的C-C、CH-O和C≡N化学键。此外,耦合实验期间的高剂量电子束促使聚酰亚胺薄膜外层形成氧化层、表面缺陷甚至挥发性气体。这归因于聚酰亚胺薄膜中分子链的大量断裂以及自由基与空气中氧气之间的相应化学反应。因此,辐照-载荷-加热耦合处理导致聚酰亚胺薄膜的粘弹性性能和力学性能显著下降。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/d1cf/9084296/b354eda2cf62/c8ra05744c-f9.jpg

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