Albishi Ali M
Electrical Engineering Department, King Saud University, Riyadh 11421, Saudi Arabia.
Sensors (Basel). 2022 Apr 26;22(9):3313. doi: 10.3390/s22093313.
This work proposes a novel coupling mechanism for a complementary split-ring resonator as a planar near-field microwave sensor for dielectric materials. The resonator is etched into the ground plane of a microstrip line. This mechanism is based on the inductive coupling synthesized by utilizing a via that connects the power plane of the microstrip line to the central island of the resonator. The proposed coupling makes the coupling capacitance between the transmission line and the resonator relatively small and insignificant compared to the capacitance of the resonator, making it more sensitive to changes in the dielectric constant of the materials under test. In addition, the coupling is no longer dependent solely on the capacitive coupling, which significantly reduces the coupling degradation caused by loading the resonator with dielectric materials, so the inductive coupling plays an important role in the proposed design. Therefore, the proposed coupling mechanism improves the sensitivity and enhances the coupling between the transmission line and the resonator. The sensor is evaluated for sensitivity, normalized resonance shift, and coupling factor using a full-wave numerical simulation. The sensitivity of the proposed sensor is 12% and 5.6% when detecting dielectric constants of 2 and 10, respectively. Compared to recent studies, the sensitivity improvement when detecting similar permittivity is 20% (1.32 times) and 9.8% (1.1 times). For verification, the proposed sensor is manufactured using PCB technology and is used to detect the presence of two dielectric laminates.
这项工作提出了一种新颖的耦合机制,用于将互补分裂环谐振器作为一种用于介电材料的平面近场微波传感器。该谐振器被蚀刻在微带线的接地平面中。这种机制基于通过利用一个过孔合成的电感耦合,该过孔将微带线的电源平面连接到谐振器的中心岛。所提出的耦合使得传输线与谐振器之间的耦合电容相比于谐振器的电容相对较小且微不足道,从而使其对被测材料的介电常数变化更加敏感。此外,该耦合不再仅仅依赖于电容耦合,这显著降低了由于在谐振器上加载介电材料而导致的耦合退化,因此电感耦合在所提出的设计中起着重要作用。因此,所提出的耦合机制提高了灵敏度并增强了传输线与谐振器之间的耦合。使用全波数值模拟对该传感器的灵敏度、归一化谐振偏移和耦合因子进行了评估。当检测介电常数分别为2和10时,所提出传感器的灵敏度分别为12%和5.6%。与最近的研究相比,在检测相似介电常数时灵敏度提高了20%(1.32倍)和9.8%(1.1倍)。为了进行验证,所提出的传感器采用印刷电路板技术制造,并用于检测两种介电层压板的存在。