Biomacromolecules. 2022 Jun 13;23(6):2614-2623. doi: 10.1021/acs.biomac.2c00354. Epub 2022 May 22.
Compared to traditional two-dimensional (2D) biochips, three-dimensional (3D) biochips exhibit the advantages of higher probe density and detection sensitivity due to their designable surface microstructure as well as enlarged surface area. In the study, we proposed an approach to prepare a 3D protein chip by deposition of a monolayer of functionalized hollow silica nanoparticles (HSNs) on an activated cyclic olefin copolymer (COC) substrate. First, the COC substrate was chemically modified through the photografting technique to tether poly[3-(trimethoxysilyl) propyl methacrylate] (PTMSPMA) brushes on it. Then, a monolayer of HSNs was deposited on the modified COC and covalently attached via a condensation reaction between the hydrolyzed pendant siloxane groups of PTMSPMA and the Si-OH groups of HSNs. The roughness of the COC substrate significantly increased to 50.3 nm after depositing a monolayer of HSNs (ranging from 100 to 700 nm), while it only caused a negligible reduction in the light transmittance of COC. The HSN-modified COC was further functionalized with epoxide groups by a silane coupling agent for binding proteins. Immunoglobulin G could be effectively immobilized on this substrate with the highest immobilization efficiency of 75.2% and a maximum immobilization density of 1.236 μg/cm, while the highest immobilization efficiency on a 2D epoxide group-modified glass slide was only 57.4%. Moreover, immunoassay results confirmed a competitive limit of detection (LOD) (1.06 ng/mL) and a linear detection range (1-100 ng/mL) of the 3D protein chip. This facile and effective approach for fabricating nanoparticle-based 3D protein microarrays has great potential in the field of biorelated detection.
与传统的二维(2D)生物芯片相比,由于其可设计的表面微观结构和增大的表面积,三维(3D)生物芯片表现出更高的探针密度和检测灵敏度的优势。在本研究中,我们提出了一种通过在活化的环状烯烃共聚物(COC)基底上沉积单层功能化空心硅纳米颗粒(HSN)来制备 3D 蛋白质芯片的方法。首先,通过光接枝技术将聚[3-(三甲氧基硅基)丙基甲基丙烯酸酯](PTMSPMA)刷接枝到 COC 基底上,对 COC 基底进行化学修饰。然后,将 HSN 的单层沉积在改性的 COC 上,并通过水解的 PTMSPMA 的侧挂硅氧烷基团与 HSN 的 Si-OH 基团之间的缩合反应将其共价连接。在沉积单层 HSN 后,COC 基底的粗糙度显著增加到 50.3nm(范围从 100 到 700nm),而 COC 的光透过率仅略有降低。通过硅烷偶联剂将环氧基进一步功能化到 HSN 改性的 COC 上,用于结合蛋白质。免疫球蛋白 G 可以有效地固定在该基底上,最高固定效率为 75.2%,最大固定密度为 1.236μg/cm,而在 2D 环氧基改性玻璃载玻片上的最高固定效率仅为 57.4%。此外,免疫测定结果证实了 3D 蛋白质芯片的竞争检测限(LOD)(1.06ng/mL)和线性检测范围(1-100ng/mL)。这种用于制备基于纳米颗粒的 3D 蛋白质微阵列的简单有效的方法在生物相关检测领域具有很大的潜力。