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大规模高深度三维扫描测量系统及算法优化

Large-scale and high-depth three dimensional scanning measurement system and algorithm optimization.

作者信息

Zhang Fan, Li ZhenYang, Zhang Liansheng, Cheng Rongjun, Huang Qiangxian, Li Ruijun, Wang Chaoqun

机构信息

School of Instrument Science and Opto-electronic Engineering, Hefei University of Technology, Hefei 230009, China.

出版信息

Rev Sci Instrum. 2022 May 1;93(5):053705. doi: 10.1063/5.0085229.

Abstract

Tapping scanning mode is an important method for measuring surface topography at the nanometer scale. It is widely used because it can eliminate lateral force and reduce damage to the tested sample. Research on three dimensional (3D) scanning technology with a large range and high depth-to-width ratio has important practical significance and engineering application value because the current scanning probe microscope has the limitations of small measurement ranges and weak Z-direction measurement ability. The high-frequency resonance of the quartz tuning fork, combined with the tungsten stylus, is used in this paper. It has the ability to measure the surface profile of the microdevice with a large aspect ratio. The proposed 3D scanning measurement system has realized a microstructure measurement with a depth of ∼58 µm. The entire measuring range is 400 × 400 × 400 µm, and the vertical resolution reaches 0.28 nm. The system can accurately obtain the 3D surface topography of the microfluidic biochip. In addition, a sliding window algorithm (SWA) based on errors in the scanning process and low scanning efficiency is proposed. Compared with the point-by-line scanning algorithm, the proposed SWA reduces the mean value of the squared residuals of the 3D profile by 7.70%, thereby verifying the feasibility of the algorithm. The 3D scanning measurement system and the algorithm in the tap mode provide an important reference for the 3D topography measurement of microstructures with large aspect ratios.

摘要

轻敲扫描模式是在纳米尺度测量表面形貌的一种重要方法。它被广泛应用,因为它可以消除侧向力并减少对被测样品的损伤。由于当前扫描探针显微镜存在测量范围小和Z向测量能力弱的局限性,研究大测量范围和高深宽比的三维(3D)扫描技术具有重要的实际意义和工程应用价值。本文采用石英音叉的高频共振与钨探针相结合的方式。它有能力测量具有大长宽比的微器件的表面轮廓。所提出的3D扫描测量系统实现了深度约为58 µm的微结构测量。整个测量范围为400×400×400 µm,垂直分辨率达到0.28 nm。该系统能够准确获取微流控生物芯片的3D表面形貌。此外,针对扫描过程中的误差和扫描效率低的问题,提出了一种基于滑动窗口的算法(SWA)。与逐行扫描算法相比,所提出的SWA使3D轮廓的残差平方均值降低了7.70%,从而验证了该算法的可行性。轻敲模式下的3D扫描测量系统和算法为大长宽比微结构的3D形貌测量提供了重要参考。

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