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温度影响下金属-水界面电化学特性的电化学阻抗谱分析

EIS analysis of the electrochemical characteristics of the metal-water interface under the effect of temperature.

作者信息

Sun Funan, Peng Xiao, Bai Xiangling, Chen Zhiwei, Xie Ruizhen, He Bin, Han Pengju

机构信息

College of Civil Engineering, Taiyuan University of Technology Taiyuan 030024 China

School of Architecture and Civil Engineering, Jiangsu University of Science and Technology Zhenjiang 212003 China.

出版信息

RSC Adv. 2022 Jun 7;12(27):16979-16990. doi: 10.1039/d2ra01634f.

Abstract

The corrosion performance of metals is closely related to their durability. Available studies on metal corrosion have seldom focused on the interfacial reaction behaviour influenced by a conductive medium under different temperatures. In this work, a laboratory corrosion simulation environment has been designed for EIS measurements to investigate the electrochemical behaviour of copper immersed in distilled water in different temperature environments. The relationship between the mathematical model of impedance response and the equivalent circuit model is determined based on electrochemical kinetics theory. The complex process of the dielectric properties of distilled water affected by temperature is analysed, and a simple method for calculating the kinetic parameters is presented. The experimental and model results have a good fit, and the analysis results indicate that the semicircle in the high-frequency region of the complex impedance curve represents the charge transfer process of the conductive medium. The decrease in temperature is the major factor that inhibits the rate of dissolution and passivation, resulting in the change rate of surface coverage slowing down, until the attenuation of the mass transfer process of the conductive medium dominates the full range of AC frequencies. This model provides an improved approach for determining physical parameters based on electrochemical impedance spectroscopy to characterize the electrochemical properties of materials.

摘要

金属的腐蚀性能与其耐久性密切相关。现有的关于金属腐蚀的研究很少关注不同温度下导电介质对界面反应行为的影响。在这项工作中,设计了一个实验室腐蚀模拟环境用于进行电化学阻抗谱(EIS)测量,以研究铜在不同温度环境下浸入蒸馏水中的电化学行为。基于电化学动力学理论确定了阻抗响应的数学模型与等效电路模型之间的关系。分析了温度对蒸馏水介电特性影响的复杂过程,并提出了一种计算动力学参数的简单方法。实验结果与模型结果拟合良好,分析结果表明复阻抗曲线高频区域的半圆代表导电介质的电荷转移过程。温度降低是抑制溶解和钝化速率的主要因素,导致表面覆盖率的变化率减慢,直到导电介质传质过程的衰减在整个交流频率范围内占主导地位。该模型提供了一种基于电化学阻抗谱确定物理参数以表征材料电化学性质的改进方法。

https://cdn.ncbi.nlm.nih.gov/pmc/blobs/46d8/9172561/ea66db298cb5/d2ra01634f-f1.jpg

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