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GHz频率下低损耗聚丙烯基复合材料介电性能的调制:理论与实验

Modulation of dielectric properties in low-loss polypropylene-based composites at GHz frequencies: theory and experiment.

作者信息

Wilczyński Konrad, Wróblewska Anna, Daniszewska Agata, Krupka Jerzy, Mrozowski Michał, Zdrojek Mariusz

机构信息

Faculty of Physics, Warsaw University of Technology, 00-662, Warsaw, Poland.

Institute of Microelectronics and Optoelectronics, Warsaw University of Technology, 00-662, Warsaw, Poland.

出版信息

Sci Rep. 2022 Jul 30;12(1):13104. doi: 10.1038/s41598-022-17173-4.

Abstract

Polymer composites with high dielectric constant and low loss tangent are highly regarded as substrates for modern high-speed electronics. In this work, we analyze the high-frequency dielectric properties of two types of composites based on polypropylene infused with high-dielectric-constant microparticles. Two types of fillers are used: commercial ceramics or titanium oxide (TiO) with different concentrations. The key observation is that adding the fillers causes an increase of dielectric constants by around 100% (for highest loading) up to 4.2 and 3.4, for micro-ceramics and TiO based composites, respectively. Interestingly, for the TiO composite, the loss tangent depends on the filler loading volume, whereas the other composite has a slightly increasing tendency, however, being at the level ~ 10. To explain the experimental results, a theoretical model determined by microwave reflection and transmission through a representative volume element is proposed, which allows the investigation of the impact of volume ratio, grain shape, aggregation, and size on the loss tangent and permittivity evolution. This approach could be used for modeling other low dielectric loss materials with inclusions.

摘要

具有高介电常数和低损耗角正切的聚合物复合材料作为现代高速电子产品的基板备受关注。在这项工作中,我们分析了基于注入高介电常数微粒的聚丙烯的两种复合材料的高频介电性能。使用了两种类型的填料:商业陶瓷或不同浓度的氧化钛(TiO)。关键观察结果是,添加填料会使介电常数分别增加约100%(对于最高负载量),对于微陶瓷基复合材料和TiO基复合材料,介电常数分别达到4.2和3.4。有趣的是,对于TiO复合材料,损耗角正切取决于填料的加载体积,而另一种复合材料有轻微增加的趋势,不过处于约10的水平。为了解释实验结果,提出了一个通过微波在代表性体积单元中的反射和透射确定的理论模型,该模型允许研究体积比、颗粒形状、聚集和尺寸对损耗角正切和介电常数演变的影响。这种方法可用于对其他含夹杂的低介电损耗材料进行建模。

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