Lee Saebom, A M Tiara, Cho Gyoujin, Lee Jinkee
School of Mechanical Engineering, Sungkyunkwan University, Suwon 16419, Korea.
Department of Biophysics, Sungkyunkwan University, Suwon 16419, Korea.
Nanomaterials (Basel). 2022 Jul 28;12(15):2600. doi: 10.3390/nano12152600.
The uneven deposition at the edges of an evaporating droplet, termed the coffee-ring effect, has been extensively studied during the past few decades to better understand the underlying cause, namely the flow dynamics, and the subsequent patterns formed after drying. The non-uniform evaporation rate across the colloidal droplet hampers the formation of a uniform and homogeneous film in printed electronics, rechargeable batteries, etc., and often causes device failures. This review aims to highlight the diverse range of techniques used to alleviate the coffee-ring effect, from classic methods such as adding chemical additives, applying external sources, and manipulating geometrical configurations to recently developed advancements, specifically using bubbles, humidity, confined systems, etc., which do not involve modification of surface, particle or liquid properties. Each of these methodologies mitigates the edge deposition via multi-body interactions, for example, particle-liquid, particle-particle, particle-solid interfaces and particle-flow interactions. The mechanisms behind each of these approaches help to find methods to inhibit the non-uniform film formation, and the corresponding applications have been discussed together with a critical comparison in detail. This review could pave the way for developing inks and processes to apply in functional coatings and printed electronic devices with improved efficiency and device yield.
在过去几十年里,人们对蒸发液滴边缘的不均匀沉积现象(即咖啡环效应)进行了广泛研究,以更好地理解其潜在原因,即流动动力学,以及干燥后形成的后续图案。胶体液滴上不均匀的蒸发速率阻碍了在印刷电子学、可充电电池等领域形成均匀且同质的薄膜,并常常导致器件故障。本综述旨在突出用于减轻咖啡环效应的各种技术,从添加化学添加剂、施加外部源和操纵几何构型等经典方法,到最近开发的进展,特别是使用气泡、湿度、受限系统等,这些方法不涉及表面、颗粒或液体性质的改变。这些方法中的每一种都通过多体相互作用减轻边缘沉积,例如颗粒 - 液体、颗粒 - 颗粒、颗粒 - 固体界面以及颗粒 - 流动相互作用。这些方法背后的机制有助于找到抑制不均匀薄膜形成的方法,并且已对相应应用进行了详细讨论并给出了批判性比较。本综述可为开发用于功能涂层和印刷电子器件的墨水及工艺铺平道路,从而提高效率和器件成品率。