Yang Senyuan, Zhang Yingfan, Sha Zhou, Huang Zhengyong, Wang Haohuan, Wang Feipeng, Li Jian
State Key Laboratory of Power Transmission Equipment and System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China.
ACS Appl Mater Interfaces. 2022 Aug 31;14(34):39354-39363. doi: 10.1021/acsami.2c09602. Epub 2022 Aug 19.
Heat dissipation is necessary for the safer operation of high-power electronic devices and high-capacity batteries. Thermal meta-materials can efficiently manipulate heat flow by molding natural materials into specific structures. In this study, we construct a three-dimensional-printed meta-material structure with efficient and deterministic heat conduction through combining the 2D boron nitride (BN) with nano-diamond (DM) bridging. A research of thermal conductivity and dielectric properties exhibits that the nanosized diamond-bridged and oriented 2D boron nitride endows efficient heat transfer and maintains low dielectric loss with low filler loading. The composites loaded with 19 wt% BN platelets and 1 wt% DM have the highest thermal conductivity of 3.687 W/(m·K) in the heat flow orientation, while the thermal conductivity is only 0.632 W/(m·K) in the vertical heading of heat flow. The thermal conductive networks with thermal meta-materials based on the structural characteristics have been designed to secure critical device components from the heat source and dissipate heat flow in a definite way. The infrared images show that the temperature difference of monitoring points in different directions on the BN-oriented composite substrate is 9 °C, which realizes the protection of the heat source and key components. This study shows the latent capacity of 3D-printed structured materials for critical device component protection and heat administration applications in electronic devices and electric equipment.
散热对于高功率电子设备和高容量电池的安全运行至关重要。热超材料可以通过将天然材料塑造成特定结构来有效地控制热流。在本研究中，我们通过将二维氮化硼（BN）与纳米金刚石（DM）桥接相结合，构建了一种具有高效且确定性热传导的三维打印超材料结构。对热导率和介电性能的研究表明，纳米尺寸的金刚石桥接且取向的二维氮化硼在低填料负载下赋予了高效的热传递并保持了低介电损耗。负载19 wt% BN薄片和1 wt% DM的复合材料在热流方向上具有最高热导率3.687 W/(m·K)，而在热流垂直方向上热导率仅为0.632 W/(m·K)。基于结构特征的具有热超材料的热传导网络已被设计用于保护关键器件组件免受热源影响并以确定的方式耗散热流。红外图像显示，在BN取向复合基板上不同方向监测点的温差为9°C，实现了对热源和关键组件的保护。本研究展示了三维打印结构材料在电子设备和电气设备中保护关键器件组件及热管理应用方面的潜在能力。
