一种用于锯切80微米厚龋损牙釉质切片的机器。

A machine for sawing 80-micrometer slices of carious enamel.

作者信息

Borsboom P C, Wolfs B H, Leydsman H, Doorn N, ten Bosch J J, Liem K G

出版信息

Stain Technol. 1987 Mar;62(2):119-25. doi: 10.3109/10520298709107978.

DOI:10.3109/10520298709107978

Abstract

Design and construction of a machine that cuts 80-microns slices of sound and carious dental enamel and other calcified tissues is described. These slices can be used for quantitative microradiographic studies. Preparation takes minutes. Thickness for a given slice is uniform within 2 microns, mean thickness is within 4 microns of the intended value and roughness is about 0.1 micron. Commercial components have been used where possible. Information is provided to permit purchase of the components of the machine and its construction in the average university workshop.

摘要

本文描述了一种用于切割完好和龋损牙釉质以及其他钙化组织的80微米薄片的机器的设计与构造。这些薄片可用于定量显微放射学研究。制备只需几分钟。给定薄片的厚度在2微米内均匀，平均厚度在预期值的4微米范围内，粗糙度约为0.1微米。尽可能使用了商用部件。文中提供了相关信息，以便在普通大学车间购买该机器的部件并进行组装。